TSMC is committed to advancing Sustainable Development Goal No. set out by the United Nations, by optimizing energy and resource efficiency during semiconductor production.
![](https://esg.tsmc.com/en/update/greenManufacturing/caseStudy/67/img_01.jpg)
The company has collaborated with suppliers to create a hot DI water circulation system for wafer cleaning tools, successfully reducing DI water usage by 80%. To create more energy-saving opportunities, TSMC developed "hot DI water circulation system 2.0" in 2022, which uses a modular design to reduce the system's footprint by 60%, improve tool retrofit efficiency by 90.5%, and increase tool modification flexibility. TSMC has successfully implemented the system's demo at Fab 12B, saving 24,000 tons of water and 388,000 kWh of electricity.
![](https://esg.tsmc.com/en/update/greenManufacturing/caseStudy/67/img_02.jpg)
The company aims to save 11.6 million tons of water and 450 million kWh of electricity by 2030, through full implementation on existing 12-inch wafer GIGAFAB® facilities. TSMC continues to reduce water and power used in semiconductor process and promote environmental sustainability through green manufacturing innovation.