The ICOS™ F260 die sorting and inspection system provides high performance die sorting with integrated, fully automated inspection of diced wafer-level packages. The ICOS F260 system includes the new state-of-the-art short wave IR inspection module, which provides reliable detection of hairline and sidewall cracks with near zero overkill and underkill at high throughput. The system can also be equipped with a specialized laser groove inspection module with sensitivity to invisible laser groove cracks, which are killer defects for advanced fan-in wafer-level packages, memory and bare dies. The ICOS F260 system is highly flexible and supports many workflows, including wafer-to-tape and tape-to-tape, with a minimum changeover time for optimal tool utilization in high volume manufacturing environments.
Die sorting, Outgoing Quality Control (OQC), Known Good Die (KGD), Unit Level Traceability (ULT)