Anhui YOFC Advanced Semiconductor Company/ YASC
, CN Manufacturer
SiC power semiconductor products. We can produce 60,000 pieces of 6-inch SiC MOSFET or SBD epitaxy and wafers, 6.4 million power modules, and 18 million power single tubes annually.
SUZHOU HUATAI ELECTRONICS CO., LTD
, CN Manufacturer
RF series products, power series products, and high-end heat dissipation materials, and provides high-power packaging and testing services.
Shenzhen AST Technology Company
Shenzhen Shi, CN Manufacturer $6.0-10.0 Mil 50-100
Silicon Carbide MOSFET wafer, discrete module manufacturer. Products widely used in EV, EV Charger, renewable energy system in China market including BYD.
Yangzhou Genesis Microelectronics Co., Ltd.
, CN Manufacturer
High-frequency and small-signal transistor chips, switching diode chips, Schottky chips, power Darlingtons, high-voltage switching transistors and other products
Zhejiang Hikstor Technology Co., Ltd
, CN Manufacturer
Memory chips and semiconductor chips for the Internet of Things, Zhichuan terminals, industrial control and automotive electronics.
Yangzhou Yangjie Electronic Technology Co., Ltd
, CN Manufacturer
IDM manufacturers in China which integrates discrete semiconductor chip design and production
pSemi Inc
, US Manufacturer
RF and Power Management Components and Modules
NordAmps AB
, SE Service Company
Next generation of transistors. The nanowire transistors are fabricated by combining well-established technologies and materials
Onsemi
, US Manufacturer
Onsemi offers Discrete & Power Modules, Power Management products, Signal Conditioning & Control products, Sensors, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory products.
Transphorm Inc.
, US Manufacturer
GaN devices for high voltage power conversion applications
FLOSFIA Inc.
, JP Manufacturer
Ga2O3 materials and semiconductor devices development and manufacture
Zerro Power Systems
, SG
Design and develop next generation controllers and drivers
Wavice Inc
, KR Manufacturer, Service Company
development and manufacturing of ‘GaN based compound semiconductor and application module’ which is a core technology for future surveillance weapon system and 5G communications.