Skorpios’ unique technology and proprietary wafer scale process allow to monolithically integrate silicon with III-V gain materials used as the active medium, to create Silicon Photonic ICs.
This platform called Skorpios’ Template Assisted Bonding (STAB) can be easily integrated into existing mature Silicon CMOS manufacturing facilities, enabling the generation, detection and modulation of light to be monolithically integrated with existing CMOS technologies on a single chip.
Such ICs combine the scale and economics of the silicon industry with the power and flexibility of optics in a wafer scale process. This delivers a number of important benefits, including lower power consumption, cost reduction, greater integration and significantly higher density.
Thus, Skorpios’ technology is creating an inflection point in the semiconductor industry and revolutionizing the way information is transmitted.
In a similar modular approach to the electronic ASIC industry, Silicon Photonic ICs are constructed from a set of photonic and electrical “macrocell” building blocks. Our macrocells include modulators, detectors, lasers, and other active elements and can be configured together with companion CMOS control electronics to form Customer Specific Standard Products (CSSPs). The CSSPs can thus be rapidly designed to address varied applications, both custom, and subject to multi-source agreements (MSAs).
The modular macrocell approach also greatly reduces development expense and technical risk, whilst improving time to market.
It is our ability to offer all of these fundamental macrocells.
2.5D AND 3D INTEGRATION
Vertical device integration for:
Drastically increased performance
Shorter critical electrical paths
Faster operations on smallest possible footprint
Technology Integration Modules
BTSV
CUTSV
Traditional Cu TSVs with void-free fill
Standard TSVs us CD=10um with depth of 100um
Wider & deeper TSVs have been demonstrated
Custom dimensions are available
C-TSV (CONFORMAL TSV)
FSTSV
DBI (DIRECT BOND INTERFACE)
ZIBOND
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MEMS
MEMS technologies are often developed on four-inch and six-inch silicon wafers. Skorpios Technologies provides advanced development capabilities on a foundry-compatible eight-inch equipment set, allowing more dies per wafer and lower cost per die. The eight-inch silicon platform enables concurrent integration of MEMS technology with CMOS technology.
Skorpios helps accelerate development and commercialization of MEMS technologies, including:
Cantilever-based devices
Sealed cavity devices
Sensors with high-aspect features
Devices with unique material requirements and/or low thermal budgets
BONDING
BOSH ETCH
FLIMS
MICROFLUIDICS
Microfluidics is a key enabling technology for today’s most innovative lab-on-a-chip (LoC) applications, which are revolutionizing the life sciences industry. Microfluidics technology integrates assay operations like detection, sample pre-treatment, and sample preparation on one chip.
Skorpios helps companies accelerate development and commercialization of LoC products. The technology drivers for these products include nano-scale microfluidic channel sizes, smart sensing, and integration with signal processing — all requiring integration with CMOS.
Sacrificial Materials
SACRIFICAL MATERIALS
ELECTRODE MATERIALS
TRANSPARENT SUBSTRATES
NANOWIRES & NANOCHANNELS
Nanowires-300x225
Sensors-300x177
SENSORS
Leverage Skorpios’ Integrated Sensor Platform to bond a sensor wafer to CMOS or take advantage of our diverse materials capability to develop a custom sensor that suits your high precision application.
ESD PROTECTION
FLEX-FAB
INTEGRATED SENSOR PLATFORM
SILICON PHOTONICS
As a critical component of key subsystems in optical network systems, photonic planar lightwave circuits (PLCs) enable superior performance but are challenging and costly to develop and manufacture. By partnering with Skorpios, customers can increase the output of current silicon and quartz-based products, while accelerating the development of new PLC concepts.
Optical waveguide PLC fabrication processes are an extension of CMOS and MEMS processing technology where core lithography, etch, and thin-films technologies apply. Process control of line widths, sidewall roughness, refractive-index uniformity, film thickness, and stress are all key in optimizing device performance.
fiber optical network cable
NOVEL MATERIALS
Most CMOS semiconductor foundries can only handle a small selection of materials. Novati makes novel materials standard. We utilize an Element Review Board (ERB) to enable safe and efficient introduction of any new materials into our facilities.
