profileChina Electronics Smart Card Co., Ltd (CESC) is established and invested by CEC Corecast Corporation Limited, The First Research Institute of Ministry of Public Security and some other organizations. CESC has adopted the world most sophistic IC card, IC card module and multi-chip COB packaging lines and thus making CESC the most professional manufacturer of various IC cards, IC card modules and high capacity cards, and provided multi-chip COB packaging services that are pioneering in this field in terms of technology and product quality.
The annual production capacity of CESC is as following: IC card:430 million pieces Contact and contactless modules: 510 million piecesHigh capacity card and TF card: 20 million piecesCESC has always been seeking excellent quality, quick response customer service, never-ending technology innovation and satisfying customer demands. Under the support of the Ministry of Information Industry (MII), CESC has successfully completed many state science and technology research projects and manufacture development fund projects regarding IC card module and IC card manufacture process research, and has been granted “Excellent Research Result” award due to its contribution in the State “9-5” Science and Technology Research Project. Possessing domestic most advanced research ability on production process technology, CESC has built up domestic leading production base through its years’ research and development and batch production practice. Thus,,CESC has respectively acquired ISO9000 international quality control authentication, China Mobile SIM card manufacture certificate, IC card manufacture license issued by China State Bureau of Quality and Technical Supervision etc. qualifications. CESC has been specifically designated as the professional IC card module manufacturing base for the second generation of China national citizen ID card based on its pioneering technology and good credit that are both admitted by Ministry of Information Industry and the First Research Institute of Ministry of Public Security.
Since the very establishment, CESC has engaged itself in a mission of the development of China IC card industry, and consequently built up a co-innovative relationship with many IC card chip developers and COS developers home and abroad for the common aim of development of domestic market of IC card applications. So far, totaling about 2.4 billion pieces of various IC card modules and over 1.2 billion pieces of IC cards have been made for customers home and abroad by CESC. CESC will still carry on its philosophy of collaboration and co-development, and provide even higher qualified products and better services for the customers under the drive of innovation.
8Inch & 12Inch Wafer Back Grinding&Dicing Saw PlantCESC wafer back grinding & dicing saw plant is established in October,2013 . It installed the world most advanced wafer back grinding linking wafer mounting equipment and dicing saw equipments which are suitable to 8〞V-Notch and 12〞wafers. CESC has developed the process technologies of back grinding to 50 microns super thin wafers and sawing 50 microns scribe line. CESC is tightly following the market orientation and provides quick response to customer’s needs, and has established its own complete production management system and quality control system.The annual production capacity of Wafer back grinding&dicing saw plant is 250 thousand pieces.
Wafer scribing factory
COB assembly house
IC module house
IC assembly house
WLCSP module house
