Majelac Technologies Offers:
Wafer Dicing, IC Assembly, COB Assembly, and Flip Chip Assembly Services
Ball Bonding, Wedge Bonding, Stud Bumping, and Heavy Wire Bonding
Epoxy Die Attach, Solder Die Attach, and Eutectic Die Attach
Ultra Fine Pitch Wire Bonding down to 35 microns
Die Bonding, Wire Bonding, Transfer Molding, and Ink Marking.
Quick Turnaround Assembly Service, including Same Day Assembly Service.
Contact us today to learn more about our capabilities.
Our Standard Process
Majelac Technologies specializes in quick turnaround assembly service.
Our standard service, which includes wafer dicing through ink marking, can be completed in only 8 hours.
Our clients can ship a wafer or diced dies to us and we can ship completed devices back out the same day.
Open Cavity QFN, QFP, SOIC, and various Ceramic packages are available for immediate assembly
Please view our video to see the following services in action:
Gold Ball Bonding