PACKAGING & IC ASSEMBLY
Our European Packaging line, located in Toulouse, allows us to deliver fast-run prototypes or small series in following packages :
Plastic moulded : QFN’s, SOIC, QFP’s, DIP’s
Air cavity / Premoulded plastic : QFN’s, SOIC’s, QFP’s, DIP’s …
Ceramics (ceramic or metal lid) …
Metal packages : TO’s …
Organic packages: BGA, LGA
An investment plan is on-going to drive this line towards mid-series for plastic package. This should be effective by Q2 2019.
Larger series as to offer large portfolio and competitive prices are handled through our Top3 OSAT partnership. This allows us to offer a wide spectrum of standard and custom packaging solutions, including wafer bumping.
TEST DEVELOPPMENT & PRODUCTION
With our In-House Advantest, Teradyne, and Xcerra test platforms, complemented with 6 / 8 / 12in. Probers or Multitest handler, we develop complete test solutions (hardware & software), test hardening, test platform transfers, and production testing in our own European test floor in Toulouse and via our Asian OSAT partners. Our competences stand in DIGITAL, MIXED-SIGNAL & ANALOG, RF & MMW (up to 100GHz). We also have experience in CMOS sensors/imagers production testing.
Advantest C-Class V93K-PS1600
Semics Opus3 6 / 8 / 12 inches probers
1 room temperature
1 tri-temp -55°C / +200°C
UF300 / EG4090 8in. Probers (dual temp)
Temptronic 4010A -65°C / 200°C
Temptronic 4310A -70°C / 200°C
Our Reliability Laboratory, located in Toulouse, offers capabilities for reliability stresses such as :
- HTOL / LTOL
- I.R. Reflow, MSL preconditionning
- Thermal Cycling (VRT…)
- Humidity Storage (THNB, THB, …)
- Humidity Stress (HAST, uHAST, …)
… including development and fabrication of reliability boards in our Group facilities (Carros-France).
We also access to ESD (HBM, MM, CDM) and Latch-Up capabilities ; we may also specify correct test conditions for you.
Larger techniques and equipment may be accessed through external partners, such as irradiation stresses (doses, SEE) or mechanical oriented tests (vibrations, acceleration, etc.)….
TURN-KEY SUPPLY CHAIN
With our In-House equipments and competences, we provide Semiconductors industrialization, qualification, and production services to our Customers.
Prototyping of small and medium series is handled at our internal Hub in Toulouse (France), while larger volumes are manufactured through partnership with our Tier1 OSAT teammate.
Customers have access to our services portfolio ‘à la carte’, i.e., they may select / pick what they need.
We deliver Turn-Key Supply Chain solutions from Wafers start to Finished Goods deliveries.
We also support our Customers with ‘à la carte’ engineering or production services such as :
- Test solution development and transfer to production sites
- Reliability tests
- Packaging of fast run prototypes and production series
- Production testing and sustaining