WINPAC INC. is a Korea-based company mainly engaged in the semiconductor business. The Company provides package products and testing services. Its package products consist of fine pitch ball grid array (FBAG), land grid array (LGA), package on package (POP), flip chips, universal serial bus (USB) flash drive (UFD), solid state drive (SSD) and others. The Company offers testing on memory products, such as dynamic random-access memory (DRAM), static random-access memory (SRAM), flash and pseudo-static random-access memory (PSRAM). It also provides semiconductor test services. The Company provides its services with domestic market and to overseas markets.