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Marking Inks

Marking inks are materials used to print or mark information, such as part numbers or company logos, onto electronic components, printed circuit boards (PCBs), or other materials. These inks are designed to adhere to the surface of the materials and withstand environmental exposure, such as heat and humidity, without fading or peeling. Some commonly used marking inks include thermal transfer inks, laser-markable inks, and UV-curable inks. The selection of marking ink depends on the specific requirements of the application, such as printing speed, legibility, and durability. Bad die marking refers to the process of marking faulty or defective die (small integrated circuits) on a wafer before it is separated into individual chips. The process of bad die marking allows manufacturers to identify and discard the faulty die, thus avoiding the use of defective components in the final product. There are various methods used for bad die marking, including laser marking, inkjet marking, and electro-chemically etching. The goal of bad die marking is to make sure that faulty die are easily recognizable and that the entire batch is not contaminated.

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Jiangsu KUANGSHUN Photosensitive New Materials Co., Ltd

, CN Manufacturer

Electronic chemicals such as inks and coatings.

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SynthEdge Advanced Material Corp. Ltd

, TW Manufacturer

Photoresists: Low-reflection Black Matrix (BM) photoresists for LCD display panels and OGS touch screens, Quantum Dot (QD) photoresists for Micro-LED

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ACI Materials

, US Manufacturer

Electronic Adhesives, Inks, Pastes and Coatings

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Shin-Etsu Polymer Co., Ltd.

, JP Manufacturer

Wafer Cases, Polythiophene-base conductive polymer, Embossed/Blister carrier tape, Frame for wafer dicing

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ShenZhen RongDa Photosensitive Science & Technology Co., Ltd.

, CN Manufacturer

Photoresist;Ancillary chemicals; Positive and Negative Photoresist for FPD; Positive and Negative Photoresist for LED; g-line and i-line Positive Photoresist for IC; Positive and Negative Photoresist for advanced packaging; Developer; Thinner; EBR; Stripp

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Xandex Inc

, US Manufacturer

Test interface design and manufacturing services for Automated Test Equipment (ATE) and high speed DieMark® inking systems used to mark defective devices at wafer level test.

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