IC (Integrated Circuit) removing equipment refers to tools and machinery used to remove or extract ICs (also known as chips) from electronic packages, printed circuit boards (PCBs), and other types of substrates. The process of removing an IC typically involves heating the package or substrate to a temperature that allows the IC to be safely separated from its interconnections, or the use of a specialized tool such as a de-bonder to physically separate the IC from the substrate. The specific method used will depend on the type of package, substrate, and the IC being removed. Some common types of IC removing equipment include:
De-bonder: A specialized tool that uses mechanical force to separate the IC from the substrate.
Hot air rework station: A machine that uses hot air to heat the package or substrate and soften the adhesive that holds the IC in place, allowing it to be separated.
Infrared (IR) preheater: A machine that uses IR radiation to heat the substrate and prepare it for removal of the IC.
Pick-and-place machine: A machine that uses a vacuum or suction tool to pick up and place the IC onto or off of a substrate.
Wire bonding machine: A machine that uses a specialized tool to separate the wires that connect the IC to the substrate, allowing the IC to be removed.
It is important to note that removing an IC is a delicate process that requires specialized equipment and expertise to avoid damaging the IC or the substrate.