AMD has reportedly reached an agreement with Samsung to incorporate Samsung's advanced HBM3 memory and packaging technology into its MI300X GPUs. This collaboration is significant for AMD as it aims to strengthen its position in the AI industry and requires a reliable partner like Samsung to support its aggressive approach.
Samsung's HBM3 memory has undergone comprehensive quality tests and is poised to offer next-generation performance. The company has also presented a "hybrid" approach to NVIDIA, taking responsibility for various manufacturing processes, including wafer acquisition and 2.5D packaging. Consequently, there is substantial interest in the utilization of Samsung's technologies in the MI300X GPUs, with Samsung projected to acquire a 50% share in the HBM market next year.
By leveraging Samsung's HBM3 memory and packaging technology, the MI300X GPUs and other Instinct MI300 accelerators will serve as important components in AMD's AI growth strategy in the upcoming year.
NVIDIA, facing significant order backlogs and extended delivery times, is also considering Samsung as a potential supplier. Currently, TSMC, another major player in the chiplet packaging market, is unable to meet the high demand from the AI industry. NVIDIA is exploring options to maximize production and may pursue a "dual-source" strategy. In a recent development, it was confirmed that NVIDIA's GH200 GPUs will be powered by SK hynix HBM3e DRAM.
In the short term, Samsung is expected to supply AMD's next-generation "MI400" Instinct GPUs. Additionally, AMD plans to introduce a modified "MI300" variant tailored for the Chinese market, potentially increasing sales for both parties. The success of this collaboration will significantly impact Samsung's foundry and memory division, making it a critical turning point for the company.
