In a significant move to bolster domestic semiconductor manufacturing, CHIPS for America issued a Notice of Funding Opportunity (NOFO) on February 28, 2024. The objective is to solicit applications for research and development (R&D) activities focused on establishing and accelerating the domestic capacity for advanced packaging substrates and materials. This initiative is a critical component in the manufacturing of semiconductors, aligning with the overarching goal of enhancing technological innovation within the United States.
This NOFO, designated as the FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates, represents a strategic effort to support the development and commercial deployment of foundational semiconductor technologies by leveraging domestic research efforts, tools, resources, workers, and facilities. With an anticipated funding pool of approximately $300 million, the program seeks to drive innovation across multiple technologies, encompassing semiconductor-based, glass, and organic materials. Notably, this marks the first NOFO released by the CHIPS for America R&D program office and represents the third NOFO released overall by CHIPS for America, reflecting a firm commitment to advancing semiconductor manufacturing and R&D efforts.
The NOFO emphasizes four key objectives:
- Accelerating domestic R&D and innovation in advanced packaging materials and substrates.
- Translating domestic materials and substrate innovation into U.S. manufacturing, with a focus on enabling the packaging of semiconductors produced domestically within the United States.
- Supporting the establishment of a strong, sustainable domestic capacity for advanced packaging materials and substrate R&D, prototyping, commercialization, and manufacturing.
- Promoting the development of a skilled and diverse workforce to foster a sustainable domestic advanced packaging industry.
The focus on advanced packaging materials and substrates is paramount, as it enables semiconductor manufacturers to enhance device performance, reduce physical footprint, lower power consumption, tighten security measures, and potentially mitigate costs. At present, the majority of advanced packaging manufacturing capacity is situated in Asia. As the United States makes investments in cutting-edge semiconductor design and fabrication, the need for a cost-effective and efficient domestic advanced packaging capability becomes essential to ensure the domestic packaging of semiconductors. This capability is crucial to maintain global competitiveness, supply chain security, and resilience. Materials and substrates play a foundational role in advanced packaging, underscoring the critical importance of materials and substrates R&D to expand the U.S. packaging ecosystem.
Project Activities and Requirements Under the NOFO, the CHIPS R&D encourages collaborative proposals, emphasizing the importance of assembling teams that collectively provide the full range of expertise and capabilities necessary to achieve the program objectives. Emphasizing the focus on one or more of the Technical Areas described in the NOFO, applicants are required to propose specific Project level Technical and Non-Technical Targets, define milestones marking measurable progress, and delineate project structure aligning with program objectives.
CHIPS R&D Mission and Goals The program's overarching mission, delineated by the National Institute of Standards and Technology's (NIST) CHIPS Research and Development Office (CHIPS R&D), is aimed at accelerating the development and commercial deployment of foundational semiconductor technologies. With a vision to achieve U.S. Technology Leadership, accelerate ideas to market, and cultivate a robust semiconductor workforce, the program seeks to propel the United States into a leading position in semiconductor innovation by 2030.
By catering to the core objectives outlined in the FY2024 CHIPS R&D NAPMP Materials & Substrates NOFO, applicants and stakeholders have an opportunity to contribute meaningfully to the establishment and growth of advanced packaging materials and substrates within the United States. This initiative represents a pivotal milestone in advancing the domestic semiconductor industry, promising economic growth, job creation, and heightened global competitiveness.
