Dai Nippon Printing Co., Ltd. (DNP) has initiated extensive efforts to develop photomask manufacturing for 2nm logic semiconductors supporting Extreme Ultra-Violet (EUV) lithography, a state-of-the-art process in semiconductor manufacturing.

In this recent advancement, DNP will serve as a subcontractor and supply the newly developed technology to Rapidus Corporation, an organization based in Tokyo. Rapidus is involved in the Research and Development Project for Enhanced Infrastructures for Post-5G Information and Communication Systems, initiated by the New Energy and Industrial Technology Development Organization (NEDO).

In recent years, progress has been achieved in producing advanced logic semiconductors using EUV technology. DNP has enhanced its capability to manufacture cutting-edge semiconductors with high efficiency and quality. In 2016, DNP became the world's first commercial photomask manufacturer to introduce the multi-beam mask writing tool (MBMW).

In 2023, DNP successfully developed a photomask manufacturing process for 3-nanometer (3nm) generation EUV lithography and commenced the development of the 2nm generation technology. To address the demand for further miniaturization, DNP is embarking on thorough development of a photomask manufacturing process for 2nm generation EUV lithography, involving the operation of second and third multi-electron beam mask lithography systems in Fiscal Year 2024.

DNP aims to activate its second and third MBMW mask lithography systems in FY 2024, thereby expediting photomask development for 2nm generation EUV lithography.

DNP will collaborate as a subcontractor on the Development of Advanced Semiconductor Manufacturing Technology (Commissioned) by Rapidus, under the umbrella of NEDO’s aforementioned R&D project.

By Fiscal Year 2025, DNP is slated to finalize the manufacturing process for photomasks applicable to 2nm generation logic semiconductors supporting EUV lithography. Subsequently, from Fiscal Year 2026 onwards, DNP is set to advance the establishment of production technology with the aim of commencing mass production in Fiscal Year 2027.

DNP has also initiated development initiatives targeting the 2nm generation and beyond and has entered into a partnership with imec, a cutting-edge international research organization headquartered in Leuven, Belgium, for the joint development of next-generation EUV photomasks. DNP remains committed to bolstering Japan's semiconductor industry growth by fostering development in cooperation with various partners within the global semiconductor industry framework.