NHanced Semiconductors is making a significant investment in hybrid bonding, aiming to position itself as one of the pioneering companies in the U.S. to offer advanced packaging services. This move is strategically designed to revitalize chip packaging capabilities in the U.S., especially in the realm of high-end integration using hybrid bonding with interconnect pitches as low as 10 microns. NHanced President, Bob Patti, stated that they are currently the only commercial supplier globally for hybrid bonding of heterogeneous materials, giving them a three-year head start over competitors.
NHanced's investment in a new facility in Bloomington, Indiana, signifies a major expansion of its production capacity, with plans to establish three facilities in Indiana within three years, including near the U.S. Navy’s Crane Naval Base. The company's close collaboration with entities like Purdue University for research and development, particularly in defense-related advanced packaging, highlights their commitment to innovation and unique capabilities in the industry.
This expansion also responds to the growing demand for advanced packaging, illustrated by TSMC's struggle to meet the needs of customers like Nvidia, AMD, and Tenstorrent. TSMC's projections indicate considerable growth in the demand for advanced packaging technologies in the coming years.
NHanced's investment in the Indiana plant aims to address shortages in silicon interposers and assembly, offering a U.S. source for these critical components. Additionally, the company is poised to work with diverse materials such as gallium arsenide, indium phosphide, and lithium niobate, displaying a commitment to pushing the boundaries of chip packaging.
The partnership with the U.S. Navy, alongside plans for establishing advanced package assembly centers and collaborating with other semiconductor companies, reflects NHanced's comprehensive approach to meeting the demands of the industry.
In a broader context, NHanced's investment aligns with other developments in the U.S., such as Intel's advanced packaging technology and the collaboration between SkyWater and Deca Technologies for domestic fan-out wafer-level packaging. These investments are not only addressing the current shortages but also contributing to reducing reliance on Asian suppliers, with a focus on national security priorities.
The shift towards chiplets and heterogeneous integration, along with advanced packaging, is projected to significantly reduce production costs, making next-generation chips more economically viable. This development has the potential to reshape the semiconductor industry, akin to the era of Silicon Valley in the 1980s, by democratizing access to advanced packaging and manufacturing capabilities.
