In the ongoing discussions between and Intel, the establishment of a new chip-making complex on German soil seems promising with the upcoming meeting between Chancellor Olaf Scholz and Intel CEO Pat Gelsinger. The German government's primary objective is to promote Germany as a global leader in microelectronics. The state funding that Intel will receive for this project is still unknown and remains to be disclosed. While the Handelsblatt business daily had previously reported on the generous subsidy allocated by Germany, the exact amount is yet to be confirmed.

At the same time, Intel has announced the allocation of up to $4.6 billion to build a new semiconductor assembly and test facility in Poland. This investment is part of the company's initiative to enhance the manufacturing capabilities of chips across Europe. While the German government's subsidy to Intel for establishing a chip manufacturing facility is still uncertain, other countries in the European Union (EU) are showing a keen interest in investment opportunities for the sector. Such interest in the region is part of the bloc's objective to reduce reliance on chip imports from other nations and to bolster the EU's technological and economic sovereignty.

Overall, the upcoming meeting between Chancellor Scholz and Intel CEO Gelsinger marks a significant moment in the state's efforts to foster the growth of microelectronics in Germany. By investing in the sector, Germany seems poised to enhance its global competitiveness, stimulate economic growth and offer new employment opportunities for its citizens.