In a groundbreaking move set to redefine the semiconductor landscape, Samsung Electronics and Dutch equipment company ASML have announced their joint investment in the development and integration of High NA EUV (Extreme Ultraviolet) equipment. This significant endeavor is poised to shape the future of chip manufacturing processes, with far-reaching implications for the global technology sector.
During a state visit to the Netherlands, President Yoon Seok-yeol and King Willem-Alexander participated in the MOU signing ceremony between the Korean and Dutch governments and companies at ASML's headquarters in Veldhoven on the 12th (local time). This was followed by Samsung Electronics Chairman Lee Jae-yong and SK Chairman Chey Tae-won taking a commemorative photo with ASML Chairman Peter Bennink and other representatives, in support of cooperation between the Korean and Dutch Advanced Semiconductor Academy.
The plans to introduce High NA EUV equipment at the semiconductor advanced process Research & Development (R&D) center from 2027 marks a strategic leap for Samsung Electronics Foundry. The utilization of this cutting-edge technology, notably the TwinsEXE:5000 system, is projected to bolster its competitive edge, with the company poised to apply this equipment from the 1.4-nanometer process onward. Samsung Electronics has further solidified its commitment to innovation, having announced plans for mass-producing chips using a 2-nanometer process in 2025, followed by a 1.4-nanometer process in 2027.
Woo-kyung Lee, President of ASML Korea, provided crucial insights during the 'Semicon Korea Industry Leadership Dinner', underlining the anticipated introduction of the equipment to the EUV R&D Center in 2027. The expeditious progress in the construction of the R&D center, with an estimated value of 450 billion won, coupled with the substantial investment in the equipment, totaling 1 trillion won, underscores the strategic significance of this initiative for both Samsung Electronics and ASML.
The collaborative efforts of the two companies underscore their shared vision in spearheading advancements within the semiconductor sphere. The construction of the EUV R&D Center in Korea, established through a joint investment following the semiconductor alliance between Korea and the Netherlands, underlines a burgeoning era of collaborative research and technological exploration.
This strategic alliance, fortified by the signing of the joint R&D center, garners attention at the highest echelons of leadership, with Samsung Electronics Chairman Lee Jae-yong and President Yoon Seok-yeol and King Willem-Alexander of the Netherlands at the helm of the momentous MOU signing ceremony. The display of unity and cooperation serves as a testament to the shared commitment towards technological excellence and progress.
The significance of the High NA EUV equipment, particularly the TwinsEXE:5000 system, cannot be overstated. Recognized for its potential to print transistors 1.7 times smaller than its predecessor (NXE system), this cutting-edge technology is set to revolutionize chip manufacturing processes. ASML's pioneering delivery of high NA EUV equipment to industry major Intel in December is indicative of the global impact and anticipation surrounding this state-of-the-art technology. With Intel eyeing mass production using high-NA EUV equipment, the race towards ultra-fine process technology is poised to reach new heights.
Samsung Electronics and TSMC have also positioned themselves at the forefront of technological advancement by placing orders for high NA EUV equipment. The global implications of these strategic initiatives serve as a testament to the burgeoning era of innovation and fierce competition within the semiconductor industry.
The joint endeavor to introduce High NA EUV equipment signifies a pivotal stride forward, not just for Samsung Electronics but for the broader semiconductor landscape. With its potential to redefine chip manufacturing processes and propel technological advancement, this collaborative initiative personifies the relentless pursuit of innovation and technological excellence in the global semiconductor orbit.
