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Si on Glass Bonded Wafers

Si on Glass Bonded Wafers is a type of wafer that has a silicon layer on top of a glass substrate. The silicon layer is typically thin and serves as the active layer for electronic devices such as solar cells, sensors, and microelectromechanical systems (MEMS). The glass substrate provides mechanical support for the silicon layer and can also act as a barrier to prevent impurities from diffusing into the silicon layer. These wafers are used in a variety of applications where the combination of the mechanical properties of glass and the electronic properties of silicon is desirable. For example, Si on Glass Bonded Wafers can be used in the manufacture of thin-film solar cells, where the glass substrate provides a cost-effective and mechanically stable platform for the silicon photovoltaic layer. They can also be used in the fabrication of sensors and MEMS devices, where the combination of the glass substrate and silicon layer allows for the integration of optical and electrical functions.

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Inphotec S.r.l.

, IT Custom Manufacturer

INPHOTEC makes available six technological platforms: Graphene Integrated Photonics, Silicon Photonics, Glass on Silicon, Hybrid Integration, LiNbO3 on Insulator (LNOI), Advanced Packaging.

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Soitec

, FR Manufacturer

SOI wafers and engineered substrates

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NGK Insulators, Inc

Tokyo, JP Manufacturer

Manufacturer of HTCC ceramic packages, DBC and AMB substrates, pressed ceramic lids and bonded wafers.

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