The INPHOTEC Center started its activity in January 2015 as a part of the TeCIP Institute of Scuola Superiore Sant’Anna and has become part of an independent Foundation, owned by Scuola Superiore Sant’Anna, in February 2018. Since its birth in 2015, INPHOTEC provided high added-value technological services to major Industries, Universities, and European public institutions, and participated in several European and national projects as well.
In April 2021 the Inphotec Foundation ceased its operations and the infrastructure’s assets were assigned by Scuola Superiore Sant’Anna to CamGraPhIC S.r.l. through a “Concessione” Agreement.
Today CamGraPhIC exclusively manages the INPHOTEC facility* and continues to provide technology services, with the plan of adding more capabilities and capacity to the infrastructure.
Our mission is to deliver fabrication services and technology platforms for research, prototyping, and production of high added-value components and circuits to Industries, Universities, and Research Centres.
INPHOTEC provides innovative front-end and back-end processes to serve a broad range of applications, such as:
High speed Graphene photonics for datacom and 5G
Photonic integrated circuits and optoelectronics for telecommunications
Bio photonics and medical applications
Sensors and MEMS, MOEMS
INPHOTEC makes available six technological platforms:
“Graphene Integrated Photonics”
“Glass on Silicon”
“LiNbO3 on Insulator”
* Inphotec S.r.l. is a 100% owned subsidiary of CamGraPhIC S.r.l.
INPHOTEC includes state-of-the-art facilities for both front end as well as back end processes, which are summarized below:
550-m2 clean room area, 150-m2 service area = 700-m2
40-m2 class 100 ISO5, 190-m2 class 1000 ISO6, 320-m2 class 10000 ISO7
Gas “Electronic Grade”: nitrogen, Ar, SF6, CH2F2, C4F8, CF4, CHF3, O2, N2O, NH3, SiH2Cl2, GeH4, SiH4, H2
Gas Abatement Emergency System (chemical absorption)
Deionized Water Centralized System: 4m3/hour SEMI standard ASTM 5127-07
The centre makes available six different technological platforms.
The key equipment includes:
Lithography equipment used for the high precision definition of patterns and structures on wafer, done with Electron Beam VECTOR HB6 HR and Karl SUSS MA6 BA6
Etching equipment including plasma dry etching and wet etching done with OMEGA MORI SPTS and TMAH REACTOR
Dielectric material and metal deposition performed using STS MAC, OXFORD PLUS PRO 100, SEMCO system and VTR 7000 for dielectric, and TEMESCAL BCD 2800 for metal deposition
Metrology equipment used for the physical characterization of deposited materials as well as devices realized at INPHOTEC, performed using FILMTEK 4000E-IR and TESCAN MIRA 3 XMH
Packaging equipment for the realization of prototypes and products, including a FINETECH automatic die-attachment machine, and automatic and a manual wire-bonder, a submicron precision flip-chip machine, an automated alignment bench for optical pigtailing.