What is Soitec's position in the electronics value chain?
Soitec purchases silicon wafers from silicon manufacturers who smelt, cast and cut the material into wafers of raw silicon. Then, Soitec uses its advanced technology, primarily its Smart Cut™ process, to insert an insulating layer between two layers of silicon oxide, creating silicon-on-insulator (SOI) wafers. It then sells these wafers to integrated circuit manufacturers.
In addition to producing electronic components with increased performance and energy efficiency, SOI wafers also reduce manufacturing costs by simplifying device architecture.
Developed in the Grenoble area, the Smart Cut process is a unique technological breakthrough that uses nanotechnology on an atomic scale.
A unique business model to set an industry standard
Soitec has the largest industrial manufacturing site for SOI wafers (200 mm to 300 mm) in the world. It includes 4,500 m² of cleanrooms spread out between its three factories in France. In 2015, Soitec partnered with the Chinese company Simgui to manufacture 200-mm SOI wafers for the Chinese market and operate as a manufacturing partner (foundry model) for Soitec customers outside of China. Soitec also has a FD-SOI pilot line in Singapore.
The company introduced the Smart Cut technology on the market on a industrial scale, which today is used to make nearly all SOI wafers sold in the world. Soitec has licensing agreements with several leading wafer suppliers including the Japanese company Shin-Etsu Handotai (SEH) since 1997; SunEdison, an American company recently purchased by GlobalWafers, a Taiwanese company, since 2013; and Simgui since 2014.
Soitec products include engineered substrates, most notably silicon-on-insulator (SOI) based on our proprietary Smart Cut technology, addressing the full range of applications for electronics markets.
Digital-SOI
For Processor & connectivity SoC
To continue the pace of technology advancement, the Digital-SOI substrates line enables the best power, performance and cost for processors in mobile, IOT, consumer, automotive and networking markets at 28nm, 22nm and beyond.
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R Fe Si siteweb ENSoitec Picto RF SOI
RF-SOI
For RF Front-end Module
At the heart of every smartphone, the RF-SOI substrates product line enables the best RF performance, integration and cost for 2G, 3G, 4G, LTE-A and WiFi front-end modules in mobile communications markets.
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Power SOI siteweb ENSoitec Picto Power SOI
Power-SOI
For Smart Power ICs
For more than 15 years in mid- to high-voltage applications, the Power-SOI substrates product line enables the best reliability, energy-efficiency and cost-effectiveness in mixed-signal ICs for automotive and industrial markets.
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Photonics SOI siteweb ENSoitec Picto Photonics SOI
Photonics-SOI
For Optical Transceivers
With the increase of mobile cloud traffic, the Photonics-SOI substrates product line enables silicon-based optical transceivers allowing high data rates and cost-effective optical transmissions for next generation data centers and telecommunication networks.
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FROM TECHNOLOGIES TO ENGINEERED SUBSTRATES INNOVATION
Market-changing innovation has always been the pathway to success at Soitec, beginning with
our initial breakthrough – Smart Cut™ technology – extending through Smart Stacking™ and
our compound semiconductor and high-mobility materials epitaxy expertises. Our technology toolbox enables us to produce engineered substrates, consisting of multi-layer materials, by transferring any thin film materials on the top of any other materials while maintaining the initial crystallographic properties.
Our engineered substrates enable Soitec to address the performance, energy-efficiency and cost-efficiency requirements of electronics devices.
Schéma RD engineered substrates EN page nos matériaux
SMART CUT ™ TECHNOLOGY
TECHNOLOGIE SMART STACKING ™
COMPOUND EXPERTISE
OUR MARKETS
Soitec’s SOI and other engineered substrates provide the foundation for manufacturing the low-power, high-performance, high-reliability and cost-effective semiconductor devices required by the electronics industry.
100 % of smartphones based on Soitec RF-SOI technology
100 %
of smartphones based on Soitec RF-SOI technology
20 Billion RF IC based on Soitec RF-SOI wafers
20 Billion
RF IC based on Soitec RF-SOI wafers
6 Billion chips in automobiles based on Soitec Power-SOI wafers
6 Billion
chips in automobiles based on Soitec Power-SOI wafers
50 Billion device opportunities for the internet of things
50 Billion
device opportunities for the internet of things
Every product and process we deliver is designed to enable our customers’ electronic systems to achieve higher power efficiency, better connectivity, and enhanced speed at a competitive cost.
We create value in electronics for everyday use.
CONSUMER MOBILE AND IOT
To respond to always connected user’s stringent requirements for longer battery life, faster processing, increased data rates and lower cost, Soitec's engineered substrates enable chip makers to improve their device performance and stay ahead of the fast-paced mobile consumer electronics and Internet of Things markets.
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Soitec Wafers 1
NETWORKING AND BIG DATA
The increase in mobile cloud traffic and broader access to computing power from virtually anywhere have spurred demand for high-bandwidth data exchange and faster communication speeds. Soitec provides market-leading engineered substrates to support the development and manufacturing of electronic devices with increased computing power.
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