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SiO2 (Thermal Oxide) Silicon Wafers

In this directory you can find companies that offer thermal oxide silicon wafers (SiO2/Si) or silicon wafer oxidation services.Typically, the first step in semiconductor fabrication involves oxidizing the surface of the wafer when a thin film of silicon dioxide SiO2 is formed. This film protects the silicon surface from the penetration of foreign chemicals and serves as a mask for the subsequent diffusion process. The ability to grow on silicon a chemically stable protective film of silicon dioxide makes silicon wafers the most widely used semiconductor substrates. Oxidation, commonly referred to as thermal oxidation, is a process that is carried out in high temperature diffusion furnaces. The silicon dioxide protective film is grown in an atmosphere containing either oxygen (dry oxidation) or oxygen mixed with water vapor (wet oxidation). The temperature in the furnaces is maintained in the range from 800 to 1300C. Chlorides can also be added in the form of hydrogen chloride (HCl) to control unwanted impurities. Modern fabs tend to use vertical oxidation furnaces. Vertical process allows to better meet strict contamination control requirements, larger wafer sizes, and formation of more uniform films, save valuable clean room space. SiO2 silicon wafers have several methods of production. Dry oxidation: Silicon wafers to be oxidized are first cleaned with a detergent and an aqueous solution, solvents with xylene, isopropyl alcohol, or others. The cleaned wafers are dried and loaded into a quartz wafer holder called a boat. Then they are placed in a quartz tube or diffusion furnace cell from the operator end (loading end). High-purity oxygen or a mixture of oxygen and nitrogen is supplied through the inlet end of the pipe (source). The ""dry"" oxygen flow is controlled in the quartz tube and provides an excess of oxygen to grow the silicon dioxide on the surface of the silicon wafer. Wet oxidation: The most common ways to introduce steam, when water is the oxidizer, are: pyrophoric, high pressure, bubbler, and pulse oxidation. The main chemical reactions are as follows: Pyrophoric oxidation and high pressure: Si+2+2->+2 Bubble and pulse oxidation: Si + 2 -> + 2 Pyrophoric oxidation involves the introduction and combustion of a mixture of oxygen oxidant gas and hydrogen gas. Such systems are commonly referred to as burning hydrogen systems or burners. Water vapor is formed when the required amount of hydrogen and oxygen is introduced at the inlet of the pipe and reacts. This mixture must be strictly controlled to ensure proper combustion and to prevent the accumulation of explosive hydrogen gas. High pressure oxidation (HiPox) is technically called a water pyrosynthesis system; water vapor is formed by the reaction of ultrapure hydrogen and oxygen. The steam is then pumped out into a high pressure chamber, which is pressurized to 10 atmospheres, which speeds up the liquid oxidation process. Deionized water can also be used as a steam source. In bubble oxidation, deionized water is fed into a container called a bubbler. It maintains a constant water temperature below the boiling point () using a heating grid. Nitrogen or oxygen gas is fed into the bubbler inlet, saturated with water vapor as it rises through the water, and vented through the outlet into the diffusion oven. Bubble systems are most often used as oxidation systems. In pulsed oxidation, deionized water continuously flows to the surface of the heated bottom of the quartz container. Intensive evaporation of water occurs when it hits a hot surface. Gaseous nitrogen or oxygen flows over the evaporating water and carries the water vapor into the diffusion oven.

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Hionix Inc

, US Service Company

Advanced thin film processing services. PVD Films, Thermal Oxides & Annealing, Silicon Wafers

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WaferNet, Inc

, US Distributor, Service Company

Supplier of silicon wafers and logistical services management for the semiconductor industry. Thermal Oxiade Service.

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Global Silicon Technologies, Inc.

, US Manufacturer

Polished and oxide wafers. Wafer reclaim services.

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Polishing Corporation of America

, US Manufacturer

Silicon and sapphire wafer manufacturer, reclaim services, wafer services of dicing, grinding, thin film deposition

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SEIREN KST Corp.

, JP Custom Manufacturer, Distributor, Service Company

Deposition process services for silicon wafers for semiconductors and optical communication

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Rogue Valley Microdevices

, US Manufacturer, Service Company

Wafer services and MEMS foundry

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Virginia Semiconductor Inc

, US Custom Manufacturer

Custom Silicon Wafer Manufacturer

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3D-Oxides

, FR Manufacturer

Manufacturer of thin film wafers. Thin film growth starting from chemical precursor synthesis to process development for CBVD (Chemical Beam Vapour Deposition) systems, to material science engineering up to first concepts in devices development.

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Soitec

, FR Manufacturer

SOI wafers and engineered substrates

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Silicon Valley Microelectronics (SVM)

, US Distributor

Distributor of wafers.

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HELIOS NEW MATERIALS LTD

, CN Manufacturer, Custom Manufacturer

Provider of various polished wafers. Laser machining, cutting and dicing cervices. Reseller of polishing products like slurries, polishing pads and plates.

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Sil'tronix Silicon Technologies

Archamps, FR Manufacturer, Custom Manufacturer, Service Company

Manufacturer of silicon wafers and parts. Thin film deposition and custom fabrication services for research and production.

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