Osiris International is a manufacturer of machines specializing in photolithographic process equipment used in semiconductor and microsystems (MEMS) technology.

All of our systems are designed exclusively for processing single substrates and are equipped with our in-house, user-friendly control panel with all the necessary features such as recipe programming, service, maintenance and user management.

Depending on customer requirements, the wafer handling is adapted for traditional silicon wafers or advanced compound semiconductor substrates (Si, SiC, GaAs, glass, a.o.). 

The use of proprietary chucks, inlays and end-effectors allows for the processing and handling of customer-specific substrates in a targeted manner, thus guaranteeing optimal results.

Our in-house design, engineering and manufacturing teams work together to customize and quickly implement technically demanding and complex customer requirements.

In addition to the production of our machines, which range from manual laboratory systems to fully automated cluster systems, we also offer components (e.g. chucks, end-effectors) and sub-systems (e.g. dispense systems, media supply cabinets with various canister designs).

We supply our technologies worldwide to major semiconductor manufacturers and internationally renowned research and development institutions.

 

The products of the company are 

WET PROCESSING
Semi-automatic production systems
Resist Processing
Laboratory spinner systems
TEMPORARY BONDING systems
DEBONDING systems
SUB-SYSTEMS

Resist Processing
Automatic production systems

VARIXX-SERIES

Flexible configuration of processing modules
Available modules: spin coater, developer, temperature and smart-EBR
Handling thin, standard or bonded wafer (Si, glass & others)
Round wafer up to Ø300 mm (Ø12 inch)
Square substrates size up to 230 x 230 mm (9 x 9 inch)
Optional sub-systems; wafer flipper, PR dispense system (pumps, syringe, CPD) and media supply cabinets with various canister designs.

 

Designed to be used in applications:
SPIN (SPRAY) COATING, DEVELOPING, BAKING & COOLING AND EBR

VARIXX 804 
(Ø200mm) with 4 process modules


VARIXX 806 
(Ø200mm) with 6 process modules


VARIXX 1204 
(Ø300mm) with 4 process modules


Semi-automatic production systems

UNIXX-SERIES

Spin & spray coater, developer, temperature and smartEBR modules are available as stand-alone, table-top or bench mounted configurations.
Base frame design allows various process modules configurations.
Round wafer up to Ø300 mm (Ø12 inch)
Square substrate size up to 230 x 230 mm (9 x 9 inch)
Our product range also offers customized single processing systems for large substrates up to 1.300 x 1.300 mm (51 x 51 inch).

Optional sub-systems; PR dispense systems (pumps, syringe or CPD).

 

SPIN COATER - CCP
Designed to be used in applications:
SPIN  COATING with Covered Chuck Processor (CCP)

UNIXX S760+
(21x21 inch) Stand-alone system
spin coater for large substrates.


UNIXX SA30+ 
(Ø300mm) Stand-alone system with
covered chuck spin coater. (single base frame)


UNIXX SHp22+
(Ø200mm) Stand-alone system with
covered chuck spin coater & hotplate module.

SPIN COATER - open bowl
Designed to be used in applications:
SPIN  COATING with open-bowl for standard coating.

UNIXX SA30
(Ø300mm) Stand-alone system with
open bowl spin coater. (single base frame)


UNIXX SHp22 
(Ø200mm) Stand-alone system with
open bowl spin coater & hotplate module.


DEVELOPER
Designed to be used in applications:
DEVELOPING, CLEANING AND DRYING

UNIXX D20 Advanced
(Ø200mm) Stand-alone system with movable splash ring for manual load-/unload of single substrates.

UNIXX D30 Standard
(Ø300mm) Stand-alone system provide users
in science, and research with a productive, safe and clean system.

EBR
Designed to be used in applications:
smartEBR to clean the edge on flat or notch wafers.

UNIXX EBR A20
(200x200mm) Stand-alone smartEBR system.(single base frame)

HOTPLATES 
Designed to be used in applications:
SOFTBAKE (PRE-BAKE), HARDBAKE,
OPTIONAL FOR HMDS (HEXAMETHYLDISILAZANE): VAPOR PRIMING, VACUUM DRYING

UNIXX H1403
(40x40 inch) Stand-alone hotplate system with 3 hotplate modules up to 1.000 x 1.000mm substrates.


UNIXX H760
(21x21 inch) Stand-alone hotplate system up to 537 x 537mm or customized rectangular substrates.


UNIXX He45 
(Ø450mm) Stand-alone hotplate system for round or up to 320 x 320mm square
substrates.


 

UNIXX HvA20 
(Ø200mm) Stand-alone hotplate system for HMDS priming and vacuum dehydration bake.
(available as table-top or bench mounted)


UNIXX HeT20 
(Ø200mm) Table-top hotplate tool with electronic driven lifting pins.
(or bench mounted)


UNIXX HpT20 
(Ø200mm) Table-top hotplate tool with pneumatic driven lifting pins.
(or bench mounted)


SPRAY COATER
Designed to be used in applications:
SPRAY COATING for all topographies and shapes.

3D & 2D SPRAY COATER SYSTEM for flat, concave or convex surfaces

For large scale optical devices and substrates up to 21‟x 21‟
6 axis robot system & up to 2 ultra-sonic spray nozzles
Integrated heating chuck under the spray coating area
SPRAY COATER MODULE for surfaces with topographic structure

Wafer size up to Ø 300 mm (Ø12‟)
Module can be installed in automatic systems
Optional sub-systems; PR dispense systems (pumps and syringe).

UNIXX SP 760
(21x21 inch) Spray coater system with integrated heating chuck for large substrates.


UNIXX SP H22
(Ø200mm) Spray coater system with hotplate module.


UNIXX SP B20
(Ø200mm)
Bench mounted spray coater module.

 


Laboratory spinner systems

BASIXX-SERIES

Software control with recipe management function
Transparent cover with safety interrupt sensor
Solvent injection over puddle nozzle
Process bowl and splash ring removable for cleaning
Round wafer up to Ø200mm (Ø8 inch)
Square substrates size up to 150 x 150 mm (6 x 6 inch)
Available as bench mounted, table-top or stand-alone unit
Simply and cost-effective
Optional (+) electric media arm

ADDITIONAL OPTIONS

Media pump PD-10 for PR
Media- and waste tanks
External media supply (e.g. N2)
 

Designed to be used in applications:
SPIN COATING, DEVELOPING, CLEANING AND DRYING

BASIXX ST20+
(Ø200mm) Table top tool with electric media arm.


BASIXX SB20+
(Ø200mm) Bench mounted module with electric media arm.


 

BASIXX ST20
(Ø200mm) Table top tool with simple dispense over one puddle nozzle.

 


BASIXX SH22
(Ø200mm) Stand-alone system with simple dispense over one puddle nozzle and hotplate module.


WET PROCESSING
Semi- or fully-automatic production systems

CHEMIXX-SERIES
MECHANICAL PROCESSING

High pressure nozzle
Megasonic or ultra-sonic nozzle
Large area megasonic
Single or double-sided brush
 
CHEMICAL PROCESSING

SPM, SC1, SC2, DHF
BHF, SiO2, Metal etch
Chemicals via puddle or spray nozzle


Pre-defined systems for standard processes such as mask cleaning,
metal lift-off, post CMP clean and scrubbers or customized tools.

 

Designed to be used in applications:
WET CLEANING, ETCHING, POST CMP CLEAN AND METAL LIFT-OFF

CHEMIXX CL30pm
(Ø300mm) Wet cleaning system with
DI-Chamber rinse (optional).


CHEMIXX CMP30pm
(Ø300mm) Wet cleaning system for cleaning of dry and wet wafers after CMP.


CHEMIXX E 30 MASK
(9x9 inch) Photomask cleaning system.
 


 

CHEMIXX 760
(21x21 inch) Single processing cleaning, etching or developing system with integrated media supply for large substrates.


CHEMIXX 1201
(Ø300mm) Automatic cleaning, etching or developing processing system with one process chamber.


CHEMIXX 803
(Ø200mm) Automatic wet processing
system with three process chamber.

 


TEMPORARY BONDING
Manual to automatic production systems

AFIXX-SERIES

Wafer sizes from pieces up to Ø200 mm (Ø8 inch)
Suitable for very thin fragile wafers (< 40 μm) and flexible plastic materials.
Compatible with silicon, compound and glass materials
Uniform and repeatable mounting process is ideal for CMP, grinding, polishing and etching.


Temporary bonding material mroBOND L1.1.DS are organic coatings that enable back-end-of-line (BEOL) processing of ultra-thin wafers using standard semiconductor equipment.

MOUNTING ONTO DIFFERENT TYPES OF CARRIER SUBSTRATES: GLASS, SAPPHIRE, SILICON OR CERAMIC.

Designed to be used in applications:
TEMPORARY BONDING

AFIXX 22a
(Ø200mm) Automatic system with
hotplate & I/O stations.


AFIXX 20s
(Ø200mm) Semi-automatic system
with 200ºC hotplate.


AFIXX 20m
(Ø200mm) Manual system with 200ºC hotplate.


DEBONDING
Manual to automatic production systems

DEFIXX-SERIES

Wafer sizes from pieces up to Ø300 mm (Ø12 inch)
Imbedded heaters on wafer and carrier plates
Compatible with silicon, compound and glass materials
Usable with a wide range of debonding materials

It is a versatile tool that is ideal for many R&D wafer debonding applications and low volume production.
DEMOUNTING OF BACKSIDE GROUND, THINNED AND POLISHED WAFERS.

Designed to be used in applications:
DEBONDING

DEFIXX 20a
(Ø200mm) Automatic system with robot loading and unloading. (cassette to cassette)


DEFIXX 20s
(Ø200mm) Semi-automatic system with manual loading and unloading station.


DEFIXX 30m
(Ø300mm) Manual system with imbedded heaters on wafer and carrier plates.


DEFIXX 15m
(Ø150mm) Manual system with imbedded heaters on wafer and carrier plates.


SUB-SYSTEMS

In addition to our processing systems Osiris International also offers sub-systems (e.g. dispensing systems, media supply cabinets with various canister designs).

Dispensing systems
OOPXX
Oyster dispensing pump
(max. dispense volume 100ml or 200ml)

For high material viscosity:
Photoresist positive & negative, bonding material or solvent.

Programmable  pressure, rate and speed
Incl. suck-back valve
 

PD-10
Pneumatic diaphragm pump system
Handles a wide range of media viscosities, from solvents up to photoresist.

FOR APPLICATIONS

Photoresist coating for SEMI applications
Edge cleaning with solvents
Protective coating

Syringe
Automatic syringe dispense system
Dispensing of small media amounts or continuous dispense for μl/sec or any ml/sec

Syringe made of glass or one-way syringe of plastic
Different syringe sizes available: 10ml, 20ml, 50ml, 100ml and 200ml
Programmable suck-back volume and rate

Media supply cabinets
Active media cabinet
Storage up to three acid-canister
PE-HD 10 ltr. tank


Various media canister designs

Canister sizes: 5, 10, 20 ltr.
Canister Materials: SS, PP, HDPE, PVDF
Media can be heated or temperature stabilized
Continuous Pump with ultrasonic flow sensor or pressurized tank with manual flow mtr.
 

 

Files

Recommended Companies