CIL will build a 46,000 square foot advanced semiconductor packaging, power device and volume PCB Assembly (PCBA) manufacturing facility in Andover, UK, with the help of a £9m investment.
The new facility will accommodate both world-leading development labs and full-volume production areas. CIL will add new equipment, including a dicing saw, an automatic film-assisted plastic over-mold, and an epoxy fill system. The company is also increasing its process capability to offer a UK-based wafer dicing, full device over-mold service, and SiC and GaN based power module potting manufactured within a UK-based facility. CIL’s micro-electronic production and power module and device development will relocate to the new facility in March 2023, after the completion of stage 1 of the fit-out. CIL's existing facilities in Andover will gain up to 25% floor space to expand its existing PCBA and full product build capability.
Source https://www.cil-uk.co.uk/news/cil-invests-9m-and-expands-with-a-new-semiconductor-packaging-power-device-and-pcba-manufacturing-facility-in-andover-uk/
