CONNECTEC JAPAN Corporation
One stop R&D for device construction proposal, design, process proposal, prototype building, reliability testing, and volume production
, ES Manufacturer
Photonic Integration Consultancy, PIC Design, PIC Manufacturing, Characterization and testing services at wafer and chip (DIE) levels, PIC Packaging, Foundry Process Design Kits, PIC Design and Characterization
The MiQro Innovation Collaborative Center, C2MI
, CA Service Company
International reference in the fields of advanced packaging and microsystems. The C2MI is a centre of excellence for commercialization and research (CECR)
Bullen Ultrasonics, Inc.
, US Manufacturer
Advanced Ultrasonic Machining of Silicon, Ceramics and Glass for Semiconductor and MEMS applications.
ATLANT 3D Nanosystems
, DK Manufacturer
on-demand atomic layer advanced manufacturing technology based on hybrid Microreactor Selective Area Direct Atomic Processing.
, IE Manufacturer, Service Company
Open-access Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot line
Fraunhofer Institute for Integrated Systems and Device Technology, IISB
, DE Manufacturer, Service Company
π-Fab - Prototype Fabrication, SiC-Services, Failure Analysis, Trouble Shooting in Power Electronics, Equipment and processes for the production of crystalline bulk and layer materials for electronics, comprising silicon, wide-band-gap semiconductors.
, PT Manufacturer, Turnkey Systems Integrator
Modern MES solution for manufacturers of discrete products with special focus on the following industries: Semiconductor, Electronics and Medical Devices
, US Manufacturer, Service Company
Open cavity plastic packages, wafer preparation services, wafer dicing, IC and MEMS packaging.