We enable on-demand next-generation microdevices printing on simple and complex surfaces atom-by-atom.
MEMS and Integrated Sensors, Microfluidics and Lab-on-Chip, RF-devices, Optical and Photonic Devices, Quantum and Energy-Harvesting/Storage Devices can be developed with ATLANT3D™ technology with previously impossible functionality and speed at a fraction of a cost.
Unique ATLANT3D™ technology allows
- Rapid atomic layer prototyping and manufacturing
- Highly selective atomic layer patterning
- Excellent 2D/3D conformal deposition on simple and complex surfaces
- Combining multiple materials with excellent compatibility
- Excellent pattern adhesion to almost any surfaces
- Digital and atomically precise control over the printing process
- With possibility to apply up to 450 different commercially available materials
>> CONTACT US TO LEARN MORE ABOUT OUR TECHNOLOGY
Highly conformal Direct Atomic Patterning at industrially graded materials on flat, corrugated and porous surfaces, with micrometer scale lateral and nanometer vertical precision.
Gas deposition
ATLANT3D™ Technology involves the sequential deposition of gasses for atomically precise patterning of various materials.
So far we tested with our technology the following materials:
TiO2, Pt, ZnO, SiO2.
And it is continuously updated.
A full list of available materials for testing and process development upon customer request can be found via this link.
Multistack printing
Our ATLANT3D™ μSADALP™ technology allows to print conformally different materials, enabling:
- High-quality multistack patterns and layers for complex devices
- Cross-geometrical printing
Print resolution:
- 400 µm line width (25 µm in development)
- Atomic monolayer (0.2 nm) vertical resolution
Complex surfaces
ATLANT3D™ Technology allows unprecedented selective patterning on flat, corrugated and porous surfaces:
- With surface roughness up to 20 μm*
- Microfluidics channels and optical gratings
- Nanostructure surfaces (nanopillar, nanograss etc.)
Substrate materials can be adapted based upon customer requirements.
NanofabricatorTM 1
ACADEMIC & INDUSTRIAL R&D
The material innovation and prototyping platform
>> DOWNLOAD THE TECH SPECS
Sequential deposition of up to 4 materials
4 different precursors and 4 different reactants can be loaded at the same time, allowing you to quickly switch between the materials you wish to deposit or test
Samples size up to 100x100 mm
The stage of NanofabricatorTM 1 can accommodate wafers up to 4’’ and other shapes under 100x100 mm
Rapid deposition
The NanofabricatorTM 1 stage can move up to 100mm/s, with a deposition speed dependent on the sample and process specifications
NanofabricatorTM 2
INDUSTRIAL R&D
The extended material innovation and small batch prototyping platform
>> DOWNLOAD THE TECH SPECS
Sequential deposition of up to 6 materials
6 different precursors and 6 different reactants can be loaded at the same time, allowing you to quickly switch between the materials you wish to deposit or test
Samples size up to 150x150 mm / 300x300 mm
The stage of NanofabricatorTM 2 can accommodate wafers up to 6’’ / 12’’ and other shapes under 150x150 mm / 300x300 mm
Rapid deposition
The NanofabricatorTM 2 stage can move up to 500mm/s, with a deposition speed dependent on the sample and process specifications
One technology with multi-process capacity
Microdevice R&D and prototyping
• Rapid functional devices prototyping
• Small-batch prototyping & iterating
• Direct-write technology
Material innovation and R&D
• Rapid testing of new materials
• Material characterization
• Quality evaluation of materials
• Developing material compounds
Integration of microdevices
Added functionalities on microdevices, such as: Integrated sensors, Surface texturing, Selective area protective coating, Selective area optical coating, Chip surgeryping & iterating, Direct-write technology
Welcome to our lab to test NanofabricatorTM 2
Current capabilities
Line Width
400 µm now, 25 µm in development, 1 µm long term goal
Multimaterial stack printing
Multiple materials can be deposited sequentially
Selective Area Deposition
Path defined processing
Printing speed
Variable from 0.1 mm/s up to 100 mm/s (Based on sample and process specifications)
Crystalline Material Growth
High quality material deposition
Selective doping
Selective surface doping possible
Temperature
RT – 300°C
Versatile Materials Platform
Possible to process several materials sequentially out of 150* possible
Surface geometry
Conformal deposition on any type of surface with corrugation up to 25 µm
Environment
Atmospheric or controlled ambient
Selective nanoparticle deposition
Tested on Pt process
Hollow microstructuring
Post process hollow structure development
MaaS - Microfabrication as a Service
Your partner in microfabrication
Feasibility Studies
Short-term project to validate your R&D or engineering challenges and design concepts
Proof of technology
Mid-term project dedicated to testing our technology to fit your technical requirements
>> REQUEST USE CASES
R&D Prototyping
Customised project for your needs to gain the freedom to experiment with our technology and know-how, to test and develop new engineering and scientific solutions
And beyond
We are open to hearing your challenges and bright ideas, and we are here to support you at any stage
Our Joint Development Specialties:
Material Innovation and R&D:
· Rapid testing of new materials
· Material characterization
· Quality evaluation of materials
· Developing material compounds
Microdevice R&D and prototyping:
· Rapid prototyping of functional devices
· Small-batch prototyping & iterating
. Direct-write technology
Integration of microdevices – adding functionalities such as:
· Integrated sensors
· Surface texturing
· Selective area protective coating
· Selective area optical coating
· Chip surgery
