Tools

Hermes CO2 Bubbler, AOI, Metis Magic Water, ESD Nozzle, AGV

SPRING PROBE PIN, POGO, TEST SOCKET, COAX SOCKET, BURN IN TEST SOCKET, WIRE PROBE, ONE PIECE SPRING PROBE PINS, MANUAL LID,

Precision instruments for semiconductor and electronics: Wire guide, Cutter, Clamp Finger, Bonding Wedge, Ceramic capillary

Synthetic diamond and related products as well facilities.

Superabrasive and conventional abrasive powders, compounds, slurries and suspensions

Various nanostructures including standard and specialized SPM probes that are compatible with all major AFM equipment in the market for most applications

Manufacture of probe needles used in wafer sort testing, LCD probe testing and LED probe testing, various nanotechnology probe applications.

Lapping Film, Polishing Tape, Diamond Powder, Polishing Slurry, Polishing Machine

Grinding and polishing tools, coolants, electronic pastes for thick film technology, thick film substrates.

Polishing abrasives for silicon wafers and other semiconductor substrates, to chemical mechanical planarization (CMP) products required for multilayered circuits on semiconductor chips, and abrasives for computer hard disks.

Diamond Slurry, CVD Diamond Tools, PCD Diamond Tools, EF Drill Bits

Ultrasonic coating solutions for MEMS/ Semiconductor, Protective Films for Dicing, Polyimide & Photoresist Coating, EMI Shielding Spray Coatings, Flip Chip Fluxing

Non-vacuum and vacuum mixers, solder paste mixers, nano premixers, pulvilizers and syringe chargers.

Plastic bottle and 200L Drum used in parking high purity chemicals.

Ultra precision laser processing, carbide cutters, MCT TOOLING, carbide precision molds, automated precision parts and measuring gauges

Sputtered films on various substrates. Technical consulting on solar cells and vacuum and plasma process. Experimental substrate cutter, 4-point probe cable.

Abrasives, cutting tools and 8", 12" reclaimed wafers.

Dispensers and accessories, Valves and pressure tanks, Desktop robot

Precision dispensing, coating and industrial dispensing equipment

Ultra-pure chemicals, lead frames treatment and post packaging treatment chemicals, equipment for the relevant processes: through Silicon Via, Micro-Bumping, MEMS, Solar Cells and other wafer level plating materials.