TA YA studied copper wire used in semiconductor industry in order to develop high value-added products. In 2003, we began investing in research and development, and incorporated technical resources from the National Cheng Kung University and other academic communities, and successfully developed Copper bonding wires that satisfy high reliability applications in semiconductor package. Our technical capabilities are competitive with Germany, Japanese, and Korean manufacturers, and we are also the only one local vendor who has passed all-stage reliability tests of Copper bonding wire by the main customers of IC package universal.
