Arizona State University and Deca Technologies have announced a significant collaboration to establish the first fan-out wafer-level packaging (FOWLP) research and development center in North America. The new Center for Advanced Wafer-Level Packaging Applications and Development aims to drive innovation in the United States, contributing to the expansion of domestic semiconductor manufacturing capabilities and advancements in fields such as artificial intelligence, machine learning, automotive electronics, and high-performance computing.
This collaboration will integrate advanced packaging technology, equipment, processes, materials, expertise, and training to facilitate the development of new capabilities from proof of concept to pilot scale. ASU's implementation of Deca’s M-Series™ fan-out and Adaptive Patterning® technologies under the Microelectronics Commons represents the university’s commitment to delivering on projects requested by the Department of Defense as part of the CHIPS and Science Act.
The new center, located at ASU Research Park in Tempe, will enhance the capabilities of the ASU-led Southwest Advanced Prototyping (SWAP) Hub, which is part of the Microelectronics Commons. This initiative also provides a significant workforce development opportunity, engaging ASU faculty and students in the work being done and providing training for technicians needed domestically, particularly in metro Phoenix, home to Intel, TSMC, Amkor, and other semiconductor companies.
ASU is dedicated to establishing onshore access to advanced-packaging capabilities in collaboration with Deca. This includes acquiring, installing, and implementing a comprehensive set of process and metrology equipment at the facility, capable of accommodating both 200mm and 300mm device wafer formats, as well as 300mm M-Series molded fan-out wafers, thereby providing unmatched flexibility for diverse customer needs and applications.
The collaboration between ASU and Deca is poised to accelerate innovation and strengthen the leadership of the U.S. technology industry. With Deca's leading fan-out technology as a foundation, including the Gen 2 M-Series with Adaptive Patterning technology, the potential for advancements in semiconductor packaging is significant.
