Infineon Technologies AG, Hyundai Motor Company, and Kia Corporation have entered into a multi-year supply agreement for silicon carbide (SiC) and silicon (Si) power semiconductors. Under this agreement, Infineon will construct and reserve manufacturing capacity to supply SiC, Si power modules, and chips to Hyundai/Kia until 2030. Hyundai/Kia will support this capacity build-up and reservation through financial contributions.
Heung Soo Kim, Executive Vice President and Head of Global Strategy Office (GSO) at Hyundai Motor Group, highlighted the significance of Infineon as a strategic partner with strong production capabilities and technological expertise in the power semiconductor market. This partnership not only ensures a stable supply of semiconductors for Hyundai Motor and Kia but also strengthens their position as leaders in the global electric vehicle (EV) market by enhancing their competitive product offerings.
Peter Schiefer, President of Infineon's Automotive Division, expressed pride in advancing the long-term partnership with Hyundai/Kia, emphasizing Infineon's commitment to providing premium, high-quality products, leveraging their system knowledge and application understanding. Infineon will continue investing in manufacturing capacity to meet the growing demand for automotive power electronics.
Infineon's power semiconductors play a crucial role in enabling the transition to electromobility. This transition is expected to drive substantial market growth for power semiconductors, particularly those based on wide bandgap materials like SiC. With the expansion of its Kulim fab, Infineon aims to establish the world's largest 200-millimeter SiC power fab. This expansion will further solidify Infineon's leading position as a high-quality, high-volume supplier to the automotive industry. The Kulim facility will complement Infineon's existing manufacturing capacity in Villach, Austria, and support further capacity expansions in Dresden, Germany, in accordance with its multi-site strategy.
