The American-Made Silicon Carbide (SiC) Packaging Prize has been launched by the U.S. Department of Energy's (DOE) Office of Electricity. This competition aims to spur innovation in SiC semiconductor packaging by inviting participants to propose, design, build, and test cutting-edge prototypes. These prototypes are intended to enhance the performance of SiC devices in high-voltage environments, such as those found in energy storage applications.

Significance of Silicon Carbide in Semiconductors

Silicon carbide is favored for semiconductor manufacturing due to its ability to withstand high levels of electrical voltage fluctuations and extreme temperatures. However, conventional packaging for SiC semiconductors tends to overheat, limiting their effectiveness in electronic equipment. Improved packaging solutions are crucial to expand the use of SiC semiconductors, particularly in advancing the transition towards clean energy technologies.

Insights from the DOE

Gene Rodrigues, Assistant Secretary for Electricity, highlighted the importance of the competition in driving innovation in SiC technology: "The competition from the Office of Electricity incentivizes researchers to develop innovative packaging techniques to enhance the performance of this technology and increase its availability."

Three Phases of the Competition

The SiC Semiconductor Packaging Prize consists of three phases with a total prize pool of $2.25 million:

  1. Phase 1 – Design Study: Participants will outline their team, progress towards developing SiC semiconductor packaging, and showcase any prototypes. Up to ten winning teams will each receive $50,000 and advance to Phase 2.
  2. Phase 2 – Initial Demonstration: Winning teams from Phase 1 will develop physical prototypes of their SiC packaging solutions meeting specific metrics. Four winning teams will receive $250,000 each and progress to Phase 3.
  3. Phase 3 – Final Demonstration: Teams will refine their SiC packaging solutions to achieve high voltage and current targets. The Grand Prize winner of Phase 3 will be awarded $750,000.

Eligibility and Submission Deadlines

The competition is open to private entities, non-federal governmental entities, academic institutions, and individuals. Submissions are due by August 30, 2024, aiming to foster collaboration and innovation in the field of SiC semiconductor technology within the United States.

Source https://www.energy.gov/oe/articles/us-department-energy-announces-225-million-american-made-sic-semiconductor-prize