Over the past decades, the integration of electronic chips in commercial devices has advanced significantly. Initially, computers housed a central processor (CPU) connected to other components through front-side-bus (FSB) interfaces. However, technological progress has led to the development of new integrated circuit (IC) architectures that employ multiple chiplets and more sophisticated electronic components, with Intel Corporation spearheading these advancements.
Intel Corporation has introduced new architectures and specifications for systems with multiple packaged chiplets, including the universal chiplet interconnect express (UCIe), which standardizes connections between chiplets in System-in-Package (SiP) designs. Intel researchers have proposed a new approach to enhance the performance of UCIe-based systems by reducing circuit frequencies to improve power efficiency and performance, as outlined in a paper in Nature Electronics.
Dr. Debendra Das Sharma, Intel Senior Fellow, emphasized the company's focus on driving multi-generational technologies like UCIe, PCI-Express, and CXL to meet the demand for power-efficient performance. The study by Dr. Das Sharma and his team delved into strategies to enhance system performance and power efficiency as bump pitches, the distance between connecting bumps on circuit boards, continue to shrink in advanced packaging, including 3D packaging.
In their analyses, the researchers discovered that reducing frequencies in UCIe-aligned technologies resulted in improved power efficiency and overall performance, contrary to the expectations based on traditional chip connectivity interfaces. This study presents a valuable approach that could shape the future advancements of interconnected systems as their underlying architecture continues to evolve.
Dr. Das Sharma expressed hope that the industry would benefit from their work through standardization, similar to their past influence on industry standard specifications. He also emphasized his commitment to evolving industry standard interconnects and the opportunities presented by the journey into chiplets and UCIe.
Intel's advancements in chiplet integration and the proposed frequency reduction approach outlined in the paper signify a significant leap forward in the pursuit of power-efficient and high-performance systems.
More information can be found at https://www.nature.com/articles/s41928-024-01126-y
