User

Backside Etcher

A backside etcher is a type of wafer process equipment used to etch or remove material from the backside of a silicon wafer or substrate. This equipment is commonly used in the semiconductor industry to prepare the backside of a wafer for further processing, such as backside metallization or thinning. The etching process can be performed using a variety of techniques, including wet etching, dry etching, and reactive ion etching. The choice of etching process will depend on the material being etched, the desired etching rate, and the desired surface finish. Some backside etchers also have features for cleaning and conditioning the wafer surface prior to etching.

Sort by:

Giga Lane Co., Ltd.

, KR Manufacturer

ICP ETCHER, DRIE ETCHER, CCP ETCHER, LED ETCHER, NANO-IMPRINTER

View Catalog View Blog

View Supplier Contact

ASE Co., Ltd

, KR Manufacturer, Custom Manufacturer

20-nano-class semiconductor silicon wafer cleaning equipment.

View Catalog View Blog

View Supplier Contact

Jiangsu Asia Electronics Technology Co., Ltd.

, CN Manufacturer

Wet etching equipment, high purity chemicals and gases delivery system.

View Catalog View Blog

View Supplier Contact

Kanamex Co., Ltd.

, JP Manufacturer, Custom Manufacturer

Photolithography-related wet processing process equipment used in semiconductor front-end processes, FPDs, MEMS, etc.

View Catalog View Blog

View Supplier Contact

Shenyang Kingsemi Co. Ltd

, CN Manufacturer

Front end wafer fabrication equipment. Developer, Coater, Scrubber, Stripper, Etcher.

View Catalog View Blog

View Supplier Contact

Actes Kyosan inc

, JP Manufacturer

Clean Room: Static Control, Storage Units, Cleaning Equipment. Process Equipment: Wet Etch Systems, Diffusion/Oxidation/Annealing, Developing.

View Catalog View Blog

View Supplier Contact