Intel Foundry Services (IFS) and Cadence Design Systems Inc. have recently announced a multiyear strategic partnership aimed at jointly developing a range of customized intellectual property (IP), optimized design flows, and techniques for Intel 18A process technology, featuring RibbonFET gate-all-around transistors and PowerVia backside power delivery. As a result of this collaboration, customers of both companies will be able to expedite the schedules of their system-on-chip (SoC) projects across process nodes from Intel 18A and beyond. This will be achieved while emphasizing performance, power efficiency, area optimization, bandwidth, and latency, particularly for artificial intelligence, high performance computing, and premium mobile applications.
Stuart Paann, Intel's senior vice president and general manager of IFS, expressed enthusiasm about broadening the partnership with Cadence to expand the IP ecosystem for IFS and provide customers with greater options. This expansion involves leveraging Cadence's renowned portfolio of leading IP and advanced design solutions to enable customers to produce high-volume, high-performance, and power-efficient SoCs using Intel's cutting-edge process technologies. Additionally, Anirudh Devgan, president and chief executive officer at Cadence, highlighted the deepened collaboration with Intel Foundry Services and the significant multiyear agreement to offer design software and leading IP at multiple Intel advanced nodes, furthering Intel's IDM 2.0 strategy and facilitating mutual customer success.
The partnership becomes particularly crucial in fast-growing market segments such as artificial intelligence/machine learning, HPC, and premium mobile computing. As these segments necessitate the latest standards in IP to capitalize on advanced packaging and silicon process technologies, Cadence's expertise in implementing trailblazing standards—such as advanced memory protocols, PCI Express, UCI Express, and others—enables joint customers to realize scalable, high-performance designs, accelerating their time to market in IFS' most advanced silicon technologies and 3D-IC packaging capabilities.
