Based on differentiated PLASMA and high-vacuum technology, it has core technology for FPD (Flat Panel Display) front-end process equipment, and is the global leader in the LCD/AMOLED/OTFT equipment market in the digital display field.
ICP DRY Etcher
Process
Plasma Treatment/Organic,Metal Deposition/Encapsulation
Applications
Mobile : AMOLED, LTPS, LTPO, Patterns
TV : AMOLED, LTPS, QD, TFT-LCD Patterns
Target : a-Si, Poly Si, SiO2, SiNx, Gate, S/D, LTPS All Layers
Mass Production Gen. (2, 3, 3.5, 4.5, 5, 5.5, 6, 6H, 8.5, 10.5)
Introduction
The Plasma Etching/Ashing system generates plasma in the chamber to etch thin film patterns and create electric circuits.
Our ICP Dry Etcher system
is optimized for the manufacture of organic light emitting displays (OLED) and liquid crystal displays (LCD).
Technology
Multiple dry etching equipment that supplies process gas to a vacuum chamber and
forms a physical and chemical reaction with plasma through RF power discharge
to perform a dry etching process on a film on a glass substrate.
Line up available for all applications (AMOLED, QD,
LTPS, LTPO, Oxide-TFT, TFT-LCD...)
Excellent mass productivity, etch rate and uniformity
Anti (MURA, ESD, ARC, Dint)
High MTBF Values
Excellent Particle Defect Control
Excellent PM Cycle
Process
Plasma Treatment (Plasma Ashing System Before OLED Evaporation)
Applications
Mass Production line : VT1500(6GH), A400(2G), A700
(4.5GH), A750(5.5GQ)
Introduction
Our facility is an essential facility for the OLED production line, and it is a flagship facility with an unrivaled position in the plasma treatment facility before deposition,
recognized for its excellent product characteristics and mass productivity by major domestic and foreign panel manufacturers .
Technology
Etch the target material on the glass by physical/chemical methods by supplying process gas and applying RF to the chamber composed of vacuum
Uniformity control through anode/cathode spacing and gas flow control
[PE Mode]
Local uniformity control by changing VVC value and coil step
[ICP Mode]
Particle excellent, PM cycle excellent, ESD excellent[common]
Research-Thermal Evaporator
Process
Plasma Treatment/Organic,Metal Deposition/Encapsulation
Applications
Research-OLED
Introduction
Research-Thermal Evaporator is specialized equipment for Small Glass Treatment/Organic, Metal Deposition Process.
Technology
Research-Thermal Evaporator is a specialized equipment that can produce small OLED panels by demonstrating the Deposit Full Auto Process on small glass through Plasma Treatment/Organic and Metal Deposition/Encapsulation processes on small glass. This equipment is easy to configure additional processes according to customer needs due to the ease of process change.
Features
Glass Size : ~200X200mm
Vacuum Range(HV) : E-7 Torr
Vacuum Range(UHV) : E-8 Torr
Organic Source Temperature : ~450℃
Metal Source Temperature : ~1800℃
Plasma Treatment Gas : N2, O2, Ar, ETC.
