With rich experience in product design and testing, applied with optimized mass production technology, E-SUN keeps developing various semiconductor equipment and related products. The main products include 150mm SMIF Pods, 200mm SMIF Pods, 300mm FOUP, 300mm FOSB, reticule SMIF Pods, Pod Opener, Pod N2 charger, etc. All products are assembly and cleaning in Class 1 Clean room .The company also set foot in the field of system cleaning containers.
To meet customers’ demands, E-SUN extended its OEM business and has become the main partner of TSMC (Taiwan Semiconductor Manufacturing Co., Ltd.) for cleaning 300mm FOSB. In addition, by cooperating with many semiconductor companies both in Taiwan and overseas, E-SUN can provide diversified service such as designing, testing, and manufacturing moulds, as well as manufacturing various plastic products according to the production process or existing patented items of the customer, that not only strengthen the capability of production and OEM of E-SUN, but also explore a new field of technological cooperation with semiconductor manufacturers.
300mm FOUP
Features of 300mm FOUP:
●Conforms to the SEMI standard
●ESD protective design
●Class 1 cleanliness or better.
●High reliability, cost-saving
200mm SMIF POD
Features of 200mm SMIF POD:
●Conforms to the SEMI standard
●Door adopts ESD static-resistant material
●Class 1 cleanliness or better
●High reliability, cost-saving
●Assemble/disassemble free when shell is being cleaned
●Door can be cleaned
●Optional Code Plate (POD code management)
●Parts’ color sare changeable according to different requirements of semiconductor process
150mm SMIF POD
Features of 150mm SMIF POD
●Conforms to the SEMI standard
●ESD protective design
●Class 1 cleanliness or better
●High reliability and cost-saving with integrated design
●Assemble/disassemble free, shell is cleanable
200mm SMIF POD Opener
Features of 200mm SMIF POD Opener:
●Conforms to the SEMI standard
●Wafer protrusion sensing and automatic wafer reseating
●Sense of wafer mapping, wafer cross-slotting and double wafer slotting
●Positioning precision reaches 0.01mm.
●Cycle Time<20 seconds
●Protocol of parallel and serial SECSΙ/ Ⅱcommunications
●Manufacturing cost-saving, easy assembly and maintenance with modular design
Full-automation POD cleaning machine
Features of full-automation POD cleaning machine:
●Two modes selection: full automation or manual operation deperd of physical circumstance
Cleaning time and working time can be set.
●Customers design solutions
●Safe use and handsome appearance with SUS stainless steel frame.
●24 hour continuous operation.
●Easy operation.
●Time-saving:cleaning and drying at one time with twin chamber design.
●Conform to high cleaning requiremet of pod.
●Compact structure: less space required.
●Adopts immerging-type ultrasonic cleaning method.
OEM business for cleaning FOSB
The features of OEM business for cleaning FOSB :
●To meet customers’ demands, E-SUN extended its OEM business and has become the main partner of TSMC (Taiwan Semiconductor Manufacturing Co., Ltd.) for cleaning 300mm FOSB. E-SUN have the high level equipment and environment which are class 1 clean room, HPLC Chromatography, liquid particle counter, air particle counter to assure the best quality.
