ASML, the leading supplier of chipmaking equipment, is set to have its incoming CEO, Christophe Fouquet, visit Taiwan soon. This visit, as reported by Commercial Times citing supply chain sources, is anticipated to involve discussions with TSMC and other relevant suppliers regarding next-generation EUV equipment.
Christophe Fouquet has been with ASML since 2008, occupying various management roles. Presently, he serves as the Executive Vice President and Chief Business Officer. Upon the retirement of CEO Peter Wennink in April, Fouquet is slated to succeed him, Wennink having held the position since July 2013.
ASML's high-level visit to TSMC has prompted speculation about potential orders for the new "High-NA EUV" (High Numerical Aperture Extreme Ultraviolet Lithography System). While TSMC has not confirmed this, the company is exploring various possibilities, including investments in advanced packaging.
It's worth noting that industry sources have indicated that the cost of High-NA EUV equipment exceeds USD 300 million. TSMC's cautious approach to adopting it is influenced by factors such as cost-effectiveness and the impending establishment of a plant in the United States. It is expected that future capital expenditures will heavily favor expanding production facilities overseas.
ASML's past challenges with U.S. chip export restrictions are also noteworthy. In 2019, the company suspended the shipment of EUV equipment to China due to these restrictions. More recently, under continued pressure from the U.S., the company canceled some shipments of Deep Ultraviolet Lithography equipment (DUV) to China.
This information underscores the complex dynamics at play in the semiconductor industry, with geopolitical factors, technological innovation, and strategic business decisions all intertwined.
