Etching
Poly-Si/Amorphous-Si HBr
SiCl4
Interconnect BCｌ3
BBr3
CHCｌ3
Dielectric Fluorocarbon Compound
Ion Implantation
BF3（B Compound）
PF3
GeF4
Sb Compound
Cleaning
CH3OH
Fluorocarbon Compound
Interconnect
Seed Layer Cu-CVD HfacCu:TMVS/TMVS
（Hfac）2Cu:DMDV
Al-CVD DMAH
DMEAA
Barrier Metal TiN-CVD TiCl4
TDMAT
TDEAT
TaN-CVD Amino tantalum Compound
Interlayer Dielectric
Low-k
(Low Dielectric Constant Film) Low-k CVD DMDMOS
Alkyl silicon compound
(High Dielectric Constant Film) BST-CVD Ba(DPM)2
Sr(DPM)2
Ti(i-OC3H7)4
SBT-CVD Sr(DPM)2
Bi(CH3)3/Solution
Ta(OC2H5)5
High-k CVD TMA
Zr[N(C2H5)2]4
Hf[N(C2H5)2]4
Ferroelectric PZT-CVD Pb(DPM)2
Zr(DPM)4
Zr(t-OC4H9)4
Ti(i-OC3H7)4
Electrode Pt(CH3)(CH3C5H4)
Ir(AcAc)3
Main Material SiCl4
GeCl4
Dopant BBr3
SOCl2
POCl3
Halide compound
Wavelength
(nm)Light emit ColorCompound SemiconductorMaterialMain MaterialDopant
2000
1500
1000
900
800
700
600
500
400
300
Infrared light
Red
Orange
Yellow
Green
blue
violet
ultravioletGaSb
InSb
CdTeHg
GaInAsP
GaInNAs
GaAlAs
AlInGaP
ZnSe
GaN
BGaN
TMG
TMSb
DMCd
Te(i-C3H7)2
TMG
PCl3 TBP
TMG
DMHy
TBA
TMG
TMA
TBA
TMA
TMG
TBA
DMZ DEZ
DMSe
TMG GaCl3
DMHｙ
TEB
TMGDMZ（P） DEZ（P）
TBA(P) TEA(P)
n-BuI（N)
Cp2Fe
DEZ（P)
DEZ（P)
DEZ（P)
t-BuLi（P)
Cp2Mg（P）
CH3SiH3（N）
