1)Specialized semi-equipment provider in de-voiding by pressure oven for wafer & package assembly.(2)Patented curing process, unique know how for DAP, DAP,CUF,Solder paste, NCP, NCF& silicon interposer application de-voiding,widely used in 3D/2.5D IC, Flip-Chip, SIP/stack package.(3)Precision automation equipment in above segment such as dispenser system and Printing system.
