OSAT Company. Design, assembly and test of semiconductor packages.

 

06....PBGA 06....CABGA 08....FCBGA 10....Stacked CSP 11....fcTMV® 11....Interposer PoP 12....fcCSP 15....fcSCSP 16....PowerSOP® 3 16....SOT-23/TSOT 17....SSOP/QSOP 17....TSSOP/MSOP 18....SOIC 18....ExposedPad TSSOP/ MSOP/SOIC/SSOP 19....LQFP 20....TQFP 21....ExposedPad LQFP 21....ExposedPad TQFP 22....MQFP 23....PLCC 24....MLF®/QFN/SON/DFN

26....PSMC 26....SOD123-FL 26....SOD128-FL 26....TO-220FP 26....DPAK 26....D2PAK 26....HSON8 26....SO8-FL 26....TSON8-FL 26....TOLL 26....LFPAK 26....LFPAK8 26....eD2PAK 26....PQFN 06....PBGA 06....CABGA 08....FCBGA 10....Stacked CSP 11....fcTMV® 11....Interposer PoP 12....fcCSP 15....fcSCSP 16....PowerSOP® 3 16....SOT-23/TSOT 17....SSOP/QSOP 17....TSSOP/MSOP 18....SOIC 18....ExposedPad TSSOP/ MSOP/SOIC/SSOP 19....LQFP 20....TQFP 21....ExposedPad LQFP 21....ExposedPad TQFP 22....MQFP 23....PLCC 24....MLF®/QFN/SON/DFN 31....Major IC Testers 31....Wafer Prober 32....Package Test Handler 32....Strip Test/Film Frame Handler 04 Technology Developments 16 Leadframe 26 31 Power 32....System Level Test 33....Discrete/Power Test 33....Burn-In Oven 33....End Of Line (EOL) Services Table of Contents MEMS & Sensors Test 06 Laminate 27....WLCSP Die Processing 27....WLFO 28....Wafer Bump (8″ & 12″) 29....Turnkey Process Flow 05 Locations 30....Cavity MEMS 30....Molded Cavity 30....Cavity LF

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