About SPIL
Established in May 1984, Siliconware Precision Industries Co., Ltd. has become one of the leading providers of comprehensive semiconductor assembly and test services. SPIL posted annual sales of NT$89.0 billion in 2019 and currently employs around 24,000 people worldwide.
Company Profile Vision & Core Value
SPIL Overview & Fact Sheet
Milestones
Organization
Our Vision is to Excel as World Class Leading Provider of Assembly and Test. Our Core value consists of mission and philosophy...
Press Center Location & Business Contact
This is the latest news and news archives for SPIL... SPIL has been dedicated to semiconductor back-end industry when it was founded in 1984. We continue to maintain our market leading position by steadily increasing capital spending while outperforming all other competitors. To serve and support our customer's manufacturing needs, SPIL maintains business service offices in China, Europe, Japan, North America and Taiwan...
ESH Management Quality
Introduction to SPIL's Environmental, Safety and Health Management and ESH policy...
Quality Management Systems
Quality System Certification Milestones
Business Continuity & Security Policy
Introduction to SPIL's Business Continuity Management (BCM),Information Security and Supply Chain Security Policy...
SPIL provides comprehensive packaging, offering lead frame base and substrate base packages, with either wire bond or flip chip interconnections. These packages satisfy most applications for customers serving the PC, hand-held product, consumer product and wire communication markets.
Besides the conventional SOP and QFP packages, SPIL has been devoted to the development of wafer thinning, fine-pitch wire bonding, stacked-die bonding, wafer bumping and flip-chip assembly technologies in order to realize advanced packages like: QFN, PBGA, TFBGA, Stacked-die CSP, WLCSP and FCBGA.
In order to meet our customer's future packaging requirements, we are continuously developing the next generation assembly technologies. Currently studies include: Through Silicon Vias, Integrated Passive Devices and 3D-SiP/3D-SIC packaging solutions.
BGA CSP
EDHS-BGA
Flip Chip Packages
PBGA
FC-CSP
LGA
QFN
TFBGA/VFBGA
WLCSP
Stacked Die Multi-Package
The electronics market trend is to offer more functionality, better performance, higher density, lower cost, along with smaller footprints and lower profiles. Siliconware Stacked die packages are continuously being upgraded to meet these demands... Siliconware's Multi-Package BGA provides an alternative multi-chip module solution when know-good-die, KGD, is not feasible...
Quad & Dual
Quad:
QFP; LQFP; TQFP; Thermally Enhanced QFP; E-pad LQFP; E-pad TQFP
Dual:
PDIP; SOJ; SOP; SSOP; TSOP I/COL TSOP I; TSOP II/LOC-TSOP II
