Niche-Tech is a semiconductor packaging materials manufacturer established in 2006 by Professor Stephen Chow and Mr. Felix Chow. With an operating history of over 10 years in Hong Kong and PRC, we are dedicated in the development, manufacture and marketing of high quality products for the Semiconductor Packaging, LED Packaging and Chip On Board industries.
Advanced packaging technology is recognized as an essential ingredient in delivering cost-effective semiconductor solutions to a variety of electronic applications today.Niche-Tech Copper (Cu) bonding wire offers significant cost advantage over Gold (Au) bonding wire. Our Cu bonding wire is an excellent replacement for Au bonding wire due to its similar electrical properties and the cost advantages.Self inductance and self capacitance are nearly the same and Cu bonding wire has lower resistivity. In applications of QFP, QFN and SOIC where resistance due to bond wire can negatively impact circuit performance, using Niche-Tech Cu bonding wire can offer better improvement. Also, a tailor-made concept of Niche-Tech is partnering with various interested parties for advanced packaging to continue to expand knowledge and lead technology development.
Niche-Tech silicone enapulant for COB LED has been demonstrated to provide the requirement of stability of the optical clarity over the lifetime of the device. It is anti-yellowing and excellent thermal stability. Products can be used on the glass, aluminum, ceramics, silver and PPA materials.
Niche-Tech Glob Top Epoxy is a high purity liquid epoxy designed for use as a glob top for Chip On Board (COB) applications. Our product exhibits minimum slumping and its rheology is designed to provide controlled flow to encapsulate electronic devises as well as to penetrate through the wire leads.Niche-Tech Glob Top Epoxy is easily dispensed,minimizes induced stress, provides improved temperature cycling performance and has excellent chemical resistance.Our formulations offer protection against moisture, chemicals and contaminants. Also, they provide mechanical support and electrically insulative properties which making Niche-Tech Glob Top Epoxy is an ideal encapsulation material for bare die and wire bonds in COB.
As smaller footprint, higher functioning devices become the norm, stacked die technology will be required to enable the advancement of modern, integrated packages. Niche-Tech Die Attach Adhesive has developed to the needs of high-reliability, small die size and high power lead-frame applications for Chip On Board (COB) applications.Our product offers the high adhesion, excellent reliability, outstanding dispensing performance and the highest electrical and thermal conductivity in any organic based system.Also, have the characteristics of high consistency properties of fast curing, superior adhesive strength, lead-free capability and good performance in high speed dispensing without tailing.
