CHPT, one of the leading providers of semiconductor test interface products, employs a unique strategy that sets it apart from much of the industry. Our vertically integrated approach operates on an “All in House” business model. By utilizing the talent of our experts in the fields of electronics, chemistry, mechanics, and optics, we are able to create a win-win situation with customers and innovate at the pace of the ever-changing semiconductor industry.
CHPT was established in Taoyuan, Taiwan in 2005, listed for trading on the Taipei Exchange in 2016 (stock code 6510), and relocated to a new R&D operational headquarters in 2019.
Self-Developed Probing Needle and Probe Card
Probe cards consist of three major components: the probe head, the substrate, and the PCB. CHPT is one of the few semiconductor test interface providers in the world that develops and manufactures these components internally and then integrates them into one probe card. To make this approach possible, CHPT began with material study, progressed to chemical solution development, and now even makes its own proprietary production equipment.
The design and manufacturing of probing needles is the latest milestone for CHPT after its success in substrate and PCB production. Using various customized needle types we are able to match the capabilities of our probe heads with the demands of each project. When developing new varieties of probing needles, CHPT first examines characteristics of the material. Then, by using chemical and micro-electrical engineering CHPT is able to manufacture a product that is customized to satisfy the test requirements of our customers. Each variety of needles undergoes strenuous tests to perfect the quality of the materials. More than two million thermal cycle tests are performed to ensure that our needles can withstand extreme test environments and continue to give accurate results time after time.
CHPT successfully introduced AI algorithms into probe card design. Utilizing big data analysis, the mechanical optimization of the probe card is completed before entering the manufacturing process.
CHPT Developed PCBs and Substrates
Through 3D signal and power integrity simulation analysis and optimization, coupled with measurement verification, CHPT applies the design standards for high-frequency and high-speed signal transmission. AI is broadly used to control different types of machines on the production line, as well as various processes including laminating, etching, and electroplating.