Since our founding, our policy has been to design dedicated socket contacts according to the customer's test environment and supply them to the customer.
As a result, we are now able to create a product group that can fully meet the diverse needs of our customers.
Below, we introduce our main products created based on the above policy.

Product introduction
Test IC socket
IC socket for burn-in
Probe head
Ancillary functions
IC tray
Test IC socket
From the probe contact product group developed in-house, we select the one that meets the customer's request and design the socket.

Various applications
Image sensor, multifunction microcomputer, in-vehicle, power device
Long-term operation
Selects a durable probe and adopts a repetitive and reliable socket structure
Special IC
Socket design that can be adapted to special ICs that retain functions on both the front and back, such as image sensors
high frequency
Uses short conduction contacts, S-parameter management
High temperature / low temperature
Selection of appropriate base material and evaluation test under high and low temperature
High current
Uses contacts with excellent heat dissipation, used in combination with special leaf spring contacts
Adoption of contacts that can make Kelvin contact even at a narrow pitch
Socket structure design, contact design that is not affected by magnetism
IC socket for burn-in
We design a socket that incorporates the characteristics required for a burn-in socket

Assortment example of standard socket molded frame

Burn socket
Low cost support with standard socket molding frame Molding of
contact holders dedicated to each device or cutting with inexpensive base material selection is possible
high temperature
Designed by selecting an appropriate base material that is not easily affected by temperature and conducting evaluation tests at high temperatures
High current
Uses contacts with excellent heat dissipation and can be used in combination with special leaf spring contacts.
Probe head
following probe card design is performed by adopting a vertical probe with low resistance and high durability developed in-house .

Supports high-precision function tests
Achieves a short conduction path for high frequency measurement
Crown-shaped tip processing enables stable contact with bumps
Repair and replacement is possible in 1-pin units
Since it contacts the pad vertically, it does not damage the pad (especially the aluminum pad).
Suppression of dust generation due to pad contact

Vertical probe type
150 μm pitch compatible example

Examples from probe to wiring

Fine pitch probe tip view (φ85 μm)
Ancillary functions
Thermal control
Control the IC in the test environment to the proper temperature.
Heat dissipation (passive)
Uses heat sink and fan to dissipate heat
Heating (passive)
Use a heater to heat
Temperature control (active)

It features a shorter temperature arrival time and higher accuracy than the chamber type , which uses a Perche element and actively applies heat and cools.

Board interface
You can flexibly connect the DUT board and the test head.
Utilizing the know-how of test IC sockets
Achieves flexible connection by supporting misalignment in the X, Y, and Z directions
Achieves a stable transmission line even at high frequencies
Supports high voltage of thousands of volts

IC tray
We perform custom design according to various requests.

We carry out everything from design to mold making and molding according to the device.
We manufacture trays that meet other needs, such as JEDEC standards and chip trays.
We design and propose according to the application and conditions such as device shipment and transportation in the manufacturing process.

JEDEC outline tray

Custom shape tray

Chip tray