Our CMP pad solutions are manufactured using the state-of-the-art polyurethane chemistry and engineering advances to provide the exact hardness, pore sizes, compressibility, and groove patterns to meet and exceed the requirements of various CMP applications while providing the lowest cost of ownership.
NexPlanar®
Using thermoset polyurethane technologies, our NexPlanar® pads enable the manufacture of smaller, faster, and more complex devices by our customers.
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Element
Serving as a foundation of NexPlanar® technology, Element pads are widely used in a variety of CMP applications today. Providing choices of hardness and porosity, the Element Series has proven success in the semiconductor industry for stable performance and low defectivity.
Ultra
Ultra pad series showcases advances in NexPlanar® polyurethane technology beyond what customers already experience with Element pads, targeting superior performance for customers’ needs in advanced nodes. Designed to offer our customers high throughput and low defectivity for a variety of targeted technology applications.
Ultra pads provides a wide range of tunable hardness, porosity and compressibility while preserving the low defect advantage of Element pads, breakthroughs in eliminating the trade-offs between high removal rate, planarization and low defectivity, and the ability to provide improved texture during use to drive higher removal rate and performance stability.
MEDEA
The MEDEA pad series utilizes the performance benefits of the Element product line with additional grooving technology and customization, and can be used for both 200 and 300mm applications.
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Epic™
Our Epic™ line of thermoplastic polishing pads offer the optimal balance of best-in-class performance, quality and cost of ownership.
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NEW! Epic Power
Epic Power thermoplastic polishing pads for SiC wafer polishing maintain low temperatures during polish for consistent removal rate throughout pad life. Sizes are available for single wafer and batch wafer polishing platforms and it is the only giant hard pad out there for batch wafer polishing.
CMP Slurries
In the 1980s, CMC Materials was established as a pioneer in chemical mechanical planarization (CMP) slurries with the introduction of the Semi-Sperse™ line of slurry products for 250nm CMP applications. These revolutionary products established our reputation as a technology leader in the semiconductor industry. Today, we are the only supplier serving a broad range of customers by offering and supporting a full line of CMP slurry solutions for all major applications.
In addition to our longstanding Semi-Sperse™ offerings, CMC Materials remains focused on technology leadership by introducing new slurry solutions which meet our customers’ evolving CMP needs while reducing cost of ownership.
Tungsten CMP Polishing Slurries
CMC Materials’ tungsten slurries have been a standard in the semiconductor industry for decades. Our products are manufactured and consumed across the world to meet the performance requirements for all technology nodes and applications.
Semi-Sperse™
The combination of high purity fumed silica, unique rate accelerating agents, and industry leading product quality standards have made our Semi-SperseTM line of tungsten CMP slurries the most used and trusted name in tungsten CMP. These products offer selective tungsten removal with world-class product quality, performance and consistency.
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Featured Product: Semi-Sperse™ W2000V
WIN™
Our WIN™ family of tungsten CMP slurries was developed to meet the requirements of advanced node applications and offers excellent removal rate, defectivity, and topography for a wide variety of applications. This product family offers a wide variety of solutions, including Advanced Selective Tungsten slurries, Non-Selective Tungsten slurries and Tungsten Buff slurries.
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Featured Product: WIN W8900 Family for High Selectivity W Bulk
Dielectric/Advanced Dielectric CMP Polishing Slurries
CMC Materials introduced the first high purity fumed silica slurries for CMP of inter-layer dielectric (ILD) materials in the early 1980’s. Today, we continue to manufacture and deliver these products with the unsurpassed quality and consistency that our customers expect.
Additionally, CMC Materials has developed a portfolio of innovative new products for polishing dielectric layers in the advanced integrations that are used in the most leading-edge technology applications. With new discoveries such as patented selectivity agents, engineered abrasive particles, and tunable removal rates and selectivity, our next-generation products offer significant benefits to end users, including improved planarity, reduced defectivity, and lower cost-of-ownership.
iDIEL™
iDiel™ is our highest performance line of Dielectric Slurries for a wide variety of polishing applications. This product family offers a wide variety of solutions, including Bulk Oxide slurries, Self-Stop slurries, and Selective Dielectric slurries.
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Featured Product: iDIEL™ D9228 A New Standard in Bulk Oxide Slurries
Featured Product: iDIEL™ D7400C A New Standard in Ceria Slurries
Copper CMP Polishing Slurries
EPOCH™
As a leading supplier of Copper CMP slurries, CMC Materials is focused on developing products with yield enhancement and lower cost of ownership. Our Copper CMP polishing slurries assume a critical role, influencing both performance and total system cost. Our next-generation EPOCH™ line of Copper slurries provides maximum flexibility to meet specific customer integration requirements.
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Barrier CMP Polishing Slurries
As the focus of Barrier CMP shifts away from early process development to yield enhancement and cost of ownership reduction, polishing slurries assume a critical role, influencing both performance and total system cost.
i-Cue™ | Sentinel™
Our new line of Sentinel™ slurries for Barrier applications are designed to meet our customer’s extensive technical requirements.
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Aluminum CMP Polishing Slurries
Our Novus™ product family contains uniquely engineered abrasive particles and chemistry to remove aluminum and the complex stack of work-function metals within the transistor gates of advanced semiconductor HKMG (High-K Metal Gate) devices.
Novus™
Our Novus™ product line was designed to stop polishing on oxide material, minimizing Aluminum recess. Novus™ slurries are formulated to optimize removal rate, limit recess and meet the most demanding defect requirements.
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Silicon Wafer Polishing Slurries
SiLECT™
Prime polished silicon wafers are the key substrate in a wide range of advanced integrated circuit (IC) applications. Prime polished wafers are a highly refined, ultra-pure crystalline silicon with ultra-flat and ultra-clean surfaces that are customized to meet customer specifications.
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Silicon Carbide Wafer Polishing Slurries
CMC Materials has developed a suite of silicon carbide wafer slurries that enable enhanced wafer throughput combined with excellent surface quality. Our two-component CMP slurries deliver removal rates that enable rapid healing of sub-surface damage and potential elimination of costly and surface damaging lapping steps.
SiCceed™
Silicon Carbide (SiC) is a wide band gap semiconductor that can operate at higher temperature, power level, and voltage. This enables improved energy efficiency in power devices, LED lighting, and telecommunications. Because of its unique properties, SiC is the material of choice for diverse applications such as Hybrid Electric vehicles, power electronic switches, and LED lighting technology.
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Rigid Disk and Magnetic Head CMP Slurries
Lustra™, Transele™, SemiSperse™
CMC Materials’ Rigid Disk slurries are specially formulated to planarize Ni-P and glass substrates to an ultra-low roughness and defects. Our solutions have enabled the rapid industry-wide transition from high-density PMR disk drives to advanced MAMR/ HAMR disk drives that are currently used by leading-edge disk drive customers in high-volume manufacturing.
Our Magnetic Head slurries are capable of polishing multiple materials in a single step, with tunable selectivity to meet stringent surface topography and planarization requirements. Our products offer multi-material polishing, tunable selectivity and low defects.
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Emerging CMP Applications
To meet the ever-increasing demands for higher computing performance, semiconductor device manufacturers have traditionally scaled down IC devices using existing materials. Many of these IC device designs and materials are approaching their physical limitations for further advancements.
To enable next-generation computing performance, there is a need to innovate new device structures, to build new integration schemes and to introduce new materials. CMC Materials is committed to technology and innovation leadership and is actively partnering with leading-edge IC device manufacturers to develop solutions which enable tomorrow’s technology. Our dedicated team of emerging CMP applications professionals support leading-edge customers with the journey from proof of concept through high-volume manufacturing.
Electronic Chemicals
Supplying security in high-purity
CMC Materials specializes in the purification, formulation, and packaging of high-purity chemicals used within the semiconductor and microelectronic manufacturing processes.
Our technology leadership and close customer collaboration ensure excellent product quality and consistent production of advanced electronic chemicals used to enable the high-performing devices of today and the next generation of technology.
Markets
We supply high-purity process chemicals to the following major markets:
Semiconductor manufacturing
Silicon wafers
Photomasks
Photovoltaic (solar cell panel) manufacturing
Flat panel display manufacturing
Hard disk drives (HDD)
Products
Our high-purity electronic chemical portfolio includes, acids and bases, solvents and solvent blends, and unique bespoke mixtures. These products are supplied in a variety of concentrations and shipping options, from bottles to drums to totes and ISO tankers.
Product Range
We offer a broad line of semiconductor-grade wet chemicals with products ranging from single digit parts-per-trillion (ppt) to parts-per-billion (ppb) cation levels depending on your needs.
Acids Bases Solvents
Acetic
Ammonium Hydroxide
Acetone
Hydrochloric
Ammonium Fluoride
DMSO
Hydrofluoric
Potassium Hydroxide
Ethyl Lactate
Hydrogen Peroxide
Sodium Hydroxide
Ethylene Glycol
Nitric
Hexamethyldisilazane
Nitric Acid Fuming
Isopropanol
Phosphoric
Methanol
Sulfuric
N-Butyl Acetate
N-methylpyrrolidone
PGMEA
Applications
Our Electronic Materials provide a broad range of products and services required to achieve specific application criteria within semiconductor and microelectronics manufacturing.
We recognize that processes may vary and may require a unique approach. At CMC Materials, we manufacture to your custom specifications or can provide our own products recommended for your specific application.
Product Range Applications
Etchants
Buffered Oxide Etchants available in Ratio’s from 5:1 upwards to 500:1
Unique surfactants for BOE range
Mixed Acid Etchants for many unique processes, including Spin Tool Silicon Etching, a wide range of metal etchants too – Aluminium, Copper, Chromium, Gold, Nickel, Platinum, Tantalum, Titanium. Our product range also includes mixtures for metal alloys and ITO materials
Post Etch Removal
Products to remove both positive and negative resists including post etch polymers
Low etch rates for a variety of materials. Effective organic residue removers
Stable formulated product
Proprietary products: Nano-Strip™ and GenSolve™
Solvent Blends
Solvents for:
Cleaning in semiconductor and related high-purity processes
Various etch-polishing processes
Ultra-low-residue vapor drying
Adhesion promoters for photoresists
Positive and negative photoresist stripping agents
Flat panel display manufacturing
Photoresist edge-bead-remover agents
High-purity intermediates for photoresist, spin-on-glass, low-k dielectric materials and anti-reflective coatings
Carriers for photoresist, abrasives, solvents and lubricants
Coolants, wetting agents and thickeners
