High precision diamond tools are used in semiconductor IC(Integrated Circuit), Display, LED, and Solar Cell manufacturing industry. Based on its own advanced technology and technical exchange with market leading companies, EHWA is developing the best quality products and contributing to the development of future growth industry such as smart devices, LED/SOLAR.
SEMICONDUCTOR
FRONT END APPLICATION


CVD CMP Pad Conditioner
New BSL CMP Pad Conditioner
Electroplated CMP Pad Conditioner
Edge Grinding Wheel
CVD CMP PAD CONDITIONER
NEW BSL CMP PAD CONDITIONER
ELECTROPLATED CMP PAD CONDITIONER
EDGE GRINDING WHEEL
BACK END APPLICATION


Back Grinding Wheel -Nano Pol(Vitrified)
Back Grinding Wheel -Resin
Polishing Wheel – DP
Polishing Wheel-GDP
Micro Blades-Resin
Micro Blades-Metal
Electroformed Micro Blade
Dicing Blade
Notch Wheel (Si)
BACK GRINDING WHEEL – NANO POL(VITRIFIED)
BACK GRINDING WHEEL – RESIN
POLISHING WHEEL – DP
POLISHING WHEEL – GDP
MICRO BLADES – RESIN
MICRO BLADES-METAL
ELECTROFORMED MICRO BLADE
DICING BLADE
NOTCH WHEEL (SI)
DISPLAY

Scribing Wheel
Edge Grinding Wheel
Notch Grinding Wheel
Electroplated Wheel
Polishing Wheel
SCRIBING WHEEL
EDGE GRINDING WHEEL
NOTCH GRINDING WHEEL
ELECTROPLATED WHEEL
POLISHING WHEEL
SOLAR

Diamond Wire -Wafer Slicing
Diamond Wire -Squaring
DIAMOND WIRE – WAFER SLICING
DIAMOND WIRE – SQUARING
LED

Back Grinding Wheel-Vitrified
Edge Grinding Wheel-Metal
Diamond Wire
BACK GRINDING WHEEL – VITRIFIED / METAL
EDGE GRINDING WHEEL – METAL
DIAMOND WIRE
 

Files