Substrate for Device
Mono Crystal Substrate
Mono Crystal Substrate
〈Basic Spec.〉 Impurity: Nitrogen<8ppm、B and Si<SIMS resolution
Orientation: (100) having off angle around 3 degree
Polishing: Regular roughness Ra<5nm, Fine polishing Ra<2nm
Size: 1ｘ1 to 10x10mm, Thickness, 0.03-3mm
〈Special Spec.〉 Orientation: (110) and (111)
Off angle: Between 0 to 5 degree selected toward plane
〈High quality crystal〉
Low FWHM of X-ray locking curve, smaller than 40 or 50arcsec
〈High quality crystal〉 Low FWHM of X-ray locking curve, smaller than 40 or 50arcsec
Mosaic Substrate
Mosaic Substrate
* Jointing 2 to 9 mono-crystals
* Each crystal is (100) orientation
* Size: <30x30mm, Thickness 0.05-2mm
Epi-Substrate
1>B-doped epitaxial layer grown on regular substrate
B concentration: 2x1016-1x1017/cm3 , Thickness: 0.5-10µm
Mobility: 1,500cm2/Vs or more
2>High quality epitaxial layer grown on regular substrate
N concentration<0.1ppm, Thickness<50µm
Item Size(mm) Othres
RN335 3×3×0.3
RN333K** 2.5×2.5×0.3 (111)face
RN555P 5×5×0.5 One face poished
RN10106PP 10×10×0.6 Both face polished
RN25256P 25×25×0.6 One face poished
Optical window
18mmφx50μm
Window having the dimension of 18mmφx50μm
Diamond has high transmission characteristics of X-ray or light.
Thinner plate 100μm is possible to supply even for 25x25mm
Thinner plate 100μm is possible to supply even for 25x25mm. As the deposition of diamond is epitaxial growth, no curl can be observed. One face may be polished for such thin plate.
To be applied for widow or heat spreader
EDP's diamond have not only harder but also higher thermal conductivity than natural diamonds. Using of high thermal conductivity, diamond is used for stabilizing of operation temperature of high power laser diode. Thin plate is enough for such application and the price of thin spreader have competitive against other heat spreading material. EDP can supply large area plate and such novel material would create novel application.
Metallization for heat spreader
EDP is supplying two kinds of metallization such as Au/Pt/Ti and Au/TiN/Ti. The thickness of each layer would be as your request. Brazing material is also put on, such as Au-Sn, Pb-Zn etc. Pattern metallization is possible for rough pattern or precise patten.
