Metallic Substrates

Sputtering Targets, Gilding Materials, Conductive Pastes.

Insulating Substrate Si3N4 for Power Semiconductor Modules, Ceramic Scintillator, Sputtering Target Materials, IC Lead Frame Materials, Lid And Seal Ring, Monodisperse Conductive Ni-P Particles, Lead Pin.

Alloy strips for lead frames and other electronic products

Leadframe Alloys

Heat sinks for semiconductor packaging W/Cu, Mo/Cu, Cu/Mo/Cu, Cu/Mo70Cu/Cu.

Semiconductor wafer: Silicon, InP, GaAs, SiC, GaP. Infrared/Ultraviolet windows:Ge, ZnSe, Si, KBr, CaF2, MgF2, BaF2, LiF, Sapphire). Photoelectric substrate: SiO2, TiO2, LiNbO3, LiTaO3, PMN-PT. Strontium Titanate (SrTiO3) single crystal up to φ35mm.

Copper and copper alloy targets; non-ferrous metal rolling processing; new material testing services. Tu00 high-purity copper, plates, strips and target blanks; 4N5 high-purity copper targets and target blanks;

Single crystal diamond subtrates and optical windows.

PECVD Tool, MW Plasma CVD system for diamond and graphene based films, magnetron sputtering system and cathode. Diamond substrates and thin films.

CVD diamond and thin diamond coatings, conductive diamond electrodes, CVD diamond equipment.

Diamond single crystals, equipment for synthesis. Diamond-based power supplies and sensors, optics.

Crystal-aligned MgO coatings on metal, glass, ceramic, and polymer substrates. Utilized for epitaxial deposition of superconductors (copper oxide or iron-based) and other functional materials

Crucibles for crystal growing, heatspreader materials, diamond and CBN precision cutting tools.

Supplier of wafers and wafer services like thin film deposition, reclaim etc.

R&D and production of refractory metal products such as tungsten alloy, molybdenum alloy and tungsten-based high specific gravity alloy.