WAFER UV ERASER SYSTEM I ( AER681 / AER682 )
Applications
Complete erasing of charges of EPROM and Flash memory.
UV Curing and Hardening.
Removal of stress induce due to manufacturing processes.
Features :
Flexible to handle 150mm and 200mm wafers without conversion
Class 1000 cleanliness
Multi wafers UV chamber for high throughput
Low cost of ownership
Wafer robot handling
Cassette to Cassette Transfer
Wafer aligner & OCR (Option)
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WAFER UV ERASER SYSTEM II ( AER8121 )
Applications
Complete erasing of charges of EPROM and Flash memory.
UV Curing and Hardening.
Removal of stress induce due to manufacturing processes.
Features :
300mm ready
Class 10 cleanliness
Modular design for future expansion
Capable of handling thin wafer
GEM full compliance
Wafer sort - FOUP to FOUP or FOUP to FOSB
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MACRO AND MICRO OPTICAL WAFER INSPECTION SYSTEM
( AWL681 / AWLM681 )
Applications
Wafer Sorting.
Optical inspection with Inkless Binning.
Features :
Atmospheric robot wafer handling
Capability to handle thin wafer (>6 mils)
Multi function- Cassette to Cassette Sort , Cassette to XY-stage for micro inspection
Inkless Binning catered to handle all Semi Std Map Format
Macro inspection (Frontside , Backside & Edge defect)
Tilting & Spin Module
Capable to integrate with any OEM Microscope
Optical Character Reader (OCR)
Smallest foot print
SEC II GEM (Option)
Wafer Aligner (Option)
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WAFER SORTING SYSTEM ( BTC681 )
Applications
Wafer sorting/packing & unpacking
Features :
Flexible to handle wafer from 120mm, 150mm & 200mm
Thin wafer handling capability down to 6 mils
SEC/GEM full compliance
Enable full wafer integrity and traceability
Eliminate human handling
Reduces wafer loss and improve yield
Safe, automated environment
Macro inspection (Frontside, Backside & Edge defect)
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WAFER SORTING SYSTEM ( BTC8121 )
Applications
Wafer sorting / packing & unpacking
Features :
300mm ready
Class 10 cleanliness
Modular design for future expansion
Capable of handling thin wafer
GEM full compliance
Enable full wafer integrity and traceability
Eliminate human handling
Reduces wafer loss and improve yield
Safe, automated environment
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OPTICAL INSPECTION MACHINE ( OPT653(V) )
Applications
3rd Optical Inspection Machine with auto conversion
Features :
Flexible to handle both lead frame & substrate
One touch auto conversion
Strip mapping for reject traceability
Reject Identification (Wire breaker/inking/scribing)
Fine pitch capability for 1x1mm device
Angular tilting mechanism to check bonding quality
SEMI/CE compliance
Networking capability - SECS/GEM
2D vision inspection for Wire & Die
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CEI Limited is a Listed
UL 508A Industrial Control Panels Manufacturer
Our Value Commitment to our Client
We will design or custom-build our clients panels to comply with UL 508A requirements
We will maintain component documentation necessary to prove compliance
We will work closely with our clients to address specific constructions or components used to ensure compliance with UL 508A
