Plasma Etch, Inc. has been a leader, innovator, and producer of plasma technology since 1980. We've developed a wide range of solutions for plasma cleaning, plasma etching, reactive ion etching (RIE), plasma treatment, surface modification, and other facets of plasma processing.
Our company, headquartered in Carson City, NV in a custom-built factory, is focused on designing and producing cutting edge technology and plasma equipment for every industry and application. From scientific research to manufacturing and everything in between, we have an ideal solution.
Semiconductor
Integrated circuits, or IC chips, are a complicated cornerstone of today's electronics. Modern IC chips incorporate an integrated circuit printed on a wafer and attached to the "package" containing electrical connections to the printed circuit board upon which the IC chip is soldered. The packaging for the IC chip also provides head transfer away from the wafer and, in some situations, a lead frame around the wafer itself.
When the IC chip contains a lead frame, the electrical connections on the wafer are bonded to the pads on the lead frame which is then bonded to the package.
Consistent bonding is imperative to the reliability and low failure rate of IC chips. In order to ensure a clean, long lasting, and electrically low resistant bond, many IC manufacturers utilize plasma technology to clean each point of contact before it is glued or soldered. Plasma treatment on semiconductors can substantially improve reliability.
Plasma Etch, Inc. has a history of working hand-in-hand with the semiconductor industry and is committed to providing unparalleled plasma treatment solutions for every possible application. Some of these applications include:
Cleaning
Removes contaminants and residue from material surfaces.Bonding
Facilitates the direct bonding of materials.Adhesion
Prepares surfaces for coating, painting, etc.Polymerization
Enables polymerization via gaseous monomers.Activation
Alters surface properties to create functional regions.
Applications for the Semiconductor Industry
Our plasma treatment systems are currently being used in the following areas for purposes such as cleaning, etching, surface activation, and increasing manufacturability:
Advanced Semiconductor Packaging and Assembly (ASPA), Wafer Level Packaging (WLP)
Encapsulation, Molding
Underfill
Wire Bond
Die Attach
Decapsulation for Failure Analysis
Via Cleaning
Bump Adhesion
Dielectric Patterning
BCB/UBM Polymer Adhesion
Wafer Pre-Treatment
Stripping/Etching
Wafer Cleaning
Descum for WLP
Microelectromechanical Plasma Surface Treatment
These systems are all around us. They power the airbag sensors in our cars, accelerometers in our cell phones, and many sensors in the aviation industry. These tiny systems mix electronics with physical sensors, and plasma cleaning is an indispensable step in ensuring the reliability of these life saving systems.
Plasma Etch, Inc. has a history of working with the microelectromechanical systems industry. We have worked with accelerometer, roll-over sensor, and air bag deployment sensor manufacturers in the automotive industry. We are committed to providing unparalleled plasma treatment solutions for every possible application. Some of these applications include:
Cleaning
Removes contaminants and residue from material surfacesBonding
Facilitates the direct bonding of materialsAdhesion
Prepares surfaces for coating, painting, etc.Polymerization
Enables polymerization via gaseous monomersActivation
Alters surface properties to create functional regions
Plasma Technology for the MEMS Industry
Our plasma systems are currently being used in the following areas for purposes such as plasma surface treatment, cleaning, etching, surface activation, and increasing manufacturability:
Accelerometers, Roll-Over Sensors, Air Bag Deployment Sensors, etc.
Device cleaning
Photoresist Descum
Stripping Materials (photoresist/BCB/etc.)
Etching Redistribution Lines
Contaminant Removal
Surface Cleaning
Roughening
Chemical Bond Activation
Increase Wettability/Flow Uniformity
