Powertech Technology Inc. (PTI), the world's leading OSAT, was founded in 1997. We serve the international customers with services including chip bumping, chip probing, IC assembly, final testing, burn in, and system level assembly. In 2017 PTI expanded the production base to Japan to serve the local automotive electronics and IoT market. And in 2018, PTI began the construction of the newest Fan Out Panel Level Package manufacturing facility in Hsinchu Science Park.
ue to the market trend of semiconductor package miniaturization, a number of technologies are invented to achieve small form factor. WLCSP is one of the solutions , which provides low cost and high performance benefits. PTI can provide WLCSP service with RDL & PI/PBO passivation based on customer requirement. PTI also provide turnkey service from design , bumping , test and backend process to meet quick time to market demand.
Capability
Fine Bump Pitch
1-2 layer RDL with multiple passivation layer available.
RDL + Plated Bump available
Application
Flash, Communication, PMIC, Memory Cards, Controller, RF, controller, handset audio.
Feature
RDL min L/S : 8/8 um
Ball Size diameter :125~250 um ( Pb- Free )
Min Pitch: 200 um
Others
Flip Chips
Wire Bond BGA
Leadframe
System in Package
