The company was established in June 1992, completed the shareholding system transformation in October 2002, and was listed on the Shenzhen Stock Exchange on March 2, 2007 (Kangqiang Electronics, 002119). It is a high-tech enterprise specializing in the development, production and sales of various semiconductor packaging materials. Mainly produce various types of semiconductor plastic package lead frames and bonding wires. Lead frames include integrated circuit frame series produced by two processes of punching and etching, surface mount series, LED surface mount array series, power electronics series and discrete device series, with an annual production capacity of over 100 billion pieces; bonding wires include keys Alloy wire and bonding copper wire series products, with a production capacity of 360 million meters, are adopted by major chip packaging companies at home and abroad. The company also produces high-end wire-cutting wire electrode wires, multi-station integrated circuit frame progressive molds and other products.
